Xerox Corporation

Chad David Freitag

Chad Johan Slenes

David Paul Platt

Ivan Andrew McCracken

Jonathan Robert Brick

Tony Russell Rogers

William Bruce Weaver

Garry A Jones

Brent Rodney Jones

Peter Johan Nystrom

Roger Gaylord Leighton

Mark Anthony Cellura

Gary Daniel Redding

Isaac S Frazier

David R Koehler

Antonio St Clair Lloyd Williams

Samuel Vincent Schultz

Jason Paul Woebkenberg

Jon Garret Judge

Ernest I Esplin

Michael Alan Fairchild

Patricia A Wang

Douglas Dean Darling

Bhaskar T Ramakrishnan

Joseph Andrew Broderick

Nasser Alavizadeh

Mirza Sabanovic

Shawn Michael Close

Gautam Dhar

Tygh James Newton

Curtis Douglass Keller

Pratima G N Rao

Bradford Stewart

Chanthy Luy

Edward Charles Grenier

David Lyell Knierim

Terrance Lee Stephens

Robert M Jacobs

Rodney Bryant Hill

Blake Terry Weimer

David Lylell Knierim

A method of manufacturing a print head includes forming a jet stack, the jet stack including a nozzle plate having an array of nozzles, attaching an array of transducers to the jet stack, wherein the array of transducers has a transducer corresponding to each nozzle, adhering an adhesive layer to the array of transducers, forming opening in the adhesive layer, each opening adjacent a transducer in the array of transducers, partially removing the adhesive layer in regions adjacent the openings, such that the adhesive layer is less thick in the regions adjacent the openings than in other regions, and filling the openings with a conductive material, such that when the conductive material is applied, any air in the openings moves into the regions of the adhesive layer with less thickness adjacent the openings.

Part design geometry for stenciling epoxies through orifices in film adhesive

A print head has a jet stack, a jet stack heating and temperature measuring element thermally connected to the jet stack, the jet stack heating and temperature measuring element including: a first, etched copper layer having heat spreading characteristics and including a resistive heat source electrically connected in series to a voltage source and a switch; an electrically insulative on a back side of the first copper layer; and a second, etched copper layer on a side of the electrically insulative layer opposite the first copper layer, the second copper layer having a temperature sensing element to sense a temperature of the print head without a thermistor, the temperature sensing element connected in series with a voltage source and a transistor. A print head may use a thermistor but the heat spreading layer eliminates the need for a heat sink to attach to the print head.

Systems and methods for heating and measuring temperature of print head jet stacks

A method of forming an electrical interconnect includes etching a lattice pattern into a contact pad on a circuit substrate as a first connection point, at least partially filling the lattice pattern with a conductive epoxy, contacting the conductive epoxy with a second connection point, and curing the epoxy.

Method of forming an electrical interconnect

A device includes a first connector arranged to connect to an ink supply, a second connector arranged to connect to a print head, a first chamber arranged between the first and second connectors, the first chamber forming an ink path from the first connector to the second connector, a second chamber arranged adjacent to the first chamber, and a compliant wall between the first and second chambers. A system includes a print head, an ink tank connected to the print head, and a compliant wall device connected between the print head and the ink tank, the compliant wall device having a first chamber forming an ink path between the print head and the ink tank and a second chamber, the first and second chamber separated by a compliant wall.

Pressure spike eliminator for print heads

A print head includes a substrate having a hole, a circuit on the substrate, the circuit having traces and a hole corresponding to the hole in the substrate, the hole forming a fluid path, and a raised structure on the substrate around the fluid path, the raised structure positioned to seal the circuit from the fluid path.

Raised fluid pass-through structure in print heads

Print head jet stack heating and temperature measurement systems and methods are disclosed that both heat the jet stack and determine a temperature of the jet stack. The heating and temperature determination are performed by a flex circuit that includes multiple layers. One of the layers heats the jet stack and another one of the layers provides data that determines the temperature of the jet stack. The heating layer and the temperature sensing layer are separated by an insulative material in the flex circuit. The temperature of the jet stack can be sent to a print head controller that then determines whether to increase or decrease the temperature of the jet stack.

An apparatus has a first structure, an adhesive layer having a first height adhered to the first structure, the adhesive layer having an array of openings, the adhesive layer having a region adjacent each opening having a height less than a first height. A print head has a stack of plates forming a jet stack, the jet stack having a nozzle plate with an array of nozzles, an array of transducers in contact with the jet stack opposite the nozzle plate, an adhesive layer having a first height adhered to the array of transducers, the adhesive layer having openings adjacent the transducers and regions adjacent the openings having a height less than the first height, and a conductive material in the openings of the adhesive layer in contact with the transducers.

An electrical interconnect has a circuit substrate and an electrical connection point on the circuit substrate. The electrical connection point includes a lattice of conductive material that is adjacent a gap in the circuit substrate and has anchor points that are attached to the circuit substrate. In some configurations, a conductive epoxy encapsulates at least a portion of the lattice of conductive material and may include a second electrical connection point that is bonded to the other electrical connection point through the conductive epoxy.

Suspended lattice for electrical interconnects

A method of manufacturing a flexible circuit, including forming a first set of traces, forming a second set of traces, and cutting a gap between the first and second set of traces.

Method of manufacturing flexible circuit substracts

A flex circuit board provides islands of electrically isolated material surrounding openings in the flex circuit board to preserve fluid integrity of passageways passing through an electrically insulating layer of the flex circuit board. The electrically isolated islands surround exits of the passageways through the electrically insulating material and extend the passageways through an electrically conductive layer of the flex circuit board. Consequently, fluid passing through the passageways and electrically isolated islands in the flex circuit board is not subjected to electrical current.

Flex circuit board with topographical structures to facilitate fluid flow through the layer

A liquid ink transport assembly mitigates the migration of ink dye from one conduit in a plurality of conduits to another conduit in the plurality of conduits. The liquid ink transport assembly includes a plurality of conduits, each conduit in the plurality having a first end and a second end, the conduits in the plurality being arranged in a parallel configuration with at least one conduit being spatially separated from an adjacent conduit by a first distance that is greater than a second distance spatially separating other conduits in the plurality of conduits, and a heater, the plurality of conduits being positioned proximate to a first side of the heater to enable the heater to heat ink being carried between the first and the second ends of the plurality of conduits.

Heated ink delivery system

A check valve unit is provided for a high-speed phase change ink image producing machine between a reservoir for receiving and holding a volume of melted ink from a source and a receiving unit, which may be a printhead system. The check valve unit includes a plurality of ball elements trapped between upper and lower housings defining a like plurality of inlet and discharge passageways. The passageways are configured to optimize flow of melted ink through the unit during charging of the secondary reservoir. The check valve unit is scalable as to size and number of reservoirs for a particular application. The unit further incorporates features that simplify the manufacturing and assembly process while maintaining optimal performance.

Check valve unit for solid ink reservoir system

A flexible circuit substrate has an integrated circuit mounted on the substrate, a first set of traces arranged to connect between a first voltage source and a first set of connectors on the integrated circuit, a second set of traces arranged to connect between a second voltage source and a second set of connectors on the integrated circuit, and a gap in the flexible circuit substrate between the first and second set of traces, the gap of sufficient width to stop an electrical arc-tracking between the first set of traces and the second set of traces. The substrate may have a second gap between the first gap and other traces.

Reduction of arc-tracking in chip on flexible circuit substrates

Growing community of inventors

Portland, OR, United States of America

Chad David Freitag