Anokiwave, Inc.

Chad Cookinham

David W Corman

Nitin Jain

Vipul Jain

Kristian N Madsen

Noyan Kinayman

Shamsun Nahar

Amir Esmaili

Illustrative embodiments significantly improve RF isolation in a packaged integrated circuit by separating the pins/pads associated with multiple RF channels from one another and also from pins/pads associated with digital circuits. Specifically, in certain exemplary embodiments, the integrated circuit is configured with the pins/pad for the digital circuits on a first edge of the chip, the pins/pads for common RF signals on a second edge of the chip opposite the first edge, and the pins/pads for the individual RF channels on third and fourth edges of the chip. The pins/pads associated with each RF channel may include multiple pins/pads (an 'RF group') and may have a central RF pin/pad with a ground pin/pad on each side of the central RF pin/pad. One or more ground pins/pads may be placed between adjacent RF groups on a given edge of the chip.

Apparatus and method for RF isolation in a packaged integrated circuit

Growing community of inventors

San Diego, CA, United States of America

Chad Cookinham