Texas Instruments Corporation

Chad Alan McKay

Ganapathy Sivakumar

In described examples, apparatus includes a first substrate that delimits a surface of a cavity and a bondline structure arranged along a periphery of the cavity, where the bondline structure extends from the first substrate, and the bondline structure configured to bond with an interposer arranged on a second substrate. The apparatus also includes a diffusion barrier on the first substrate, the diffusion barrier configured to contact the interposer and impede a contaminant against migrating from the bondline structure and entering the cavity.

Protective bondline control structure

In described examples, a bondline structure is arranged along a periphery of a cavity. The bondline structure extends from a first substrate and is configured to bond with an interposer arranged on a second substrate. A diffusion barrier is arranged on the first substrate for contacting the interposer. The diffusion barrier is arranged to impede a contaminant against migrating from the bondline structure and entering the cavity.

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St. Paul, TX, United States of America

Chad Alan McKay