Other

Cecil A Lasch, Jr

Laszlo Sipos

Karl Ursprung

An improved apparatus and method for transferring articles, such as silicon and like wafers used in making electronic devices from one station to another at variable rates of movement utilizing a fluid bearing. The apparatus and method also provide for heat treating the wafers in a furnace through which the fluid bearing extends. The fluid bearing track structure utilized is produced from a refractory, heat-resistant material, such as quartz or silicon carbide, and comprises an enclosed tube having fluid bearing passages through the base wall thereof in communication with fluid supply means. The track structure is operatively divided into at least two track sections positioned as linear continuations of each other. Article receiving means for automatically feeding articles in sequence from a supply thereof and for accepting articles in sequence following completion of treatment thereof are provided at the stations between which the wafers are transferred. Such means includes automatically indexable magazines for discharging and receiving wafers in sequence. The fluid bearing apparatus and method is constructed to rapidly accelerate slow moving or stopped wafers in sequence onto means for rapidly cooling the wafers after heat treatment so that rapid and uniform quenching may be effected and uniform results insured.

Fluid bearing transfer and heat treating apparatus and method

Improved apparatus and method for automatically withdrawing silicon wafers or like articles from a supply magazine, transporting the same on a fluid bearing to a station where such articles are pre-aligned in sequence prior to treatment thereof at an adjacent mask aligner or like mechanism, and automatically discharging the articles following such treatment thereof onto another fluid bearing for transportation thereof into a discharge magazine. Improved sensor means is provided in conjunction with the supply magazine and discharge magazine for automatically indexing such magazines to feed and receive wafers in sequence moving relative thereto. During pre-alignment operation, each wafer is automatically rotated on an air bearing until it is oriented with a flat edge surface thereof in a predetermined position, which position is maintained as the wafer is transferred into the mask aligner where fine orientation thereof is completed, either manually or automatically, in accordance with the type of mask aligner apparatus with which the pre-alignment apparatus of this invention is combined.

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Cupertino, CA, United States of America

Cecil A Lasch, Jr