International Business Machines Corporation

Catherine Ivers

Hariklia Deligianni

John Michael Cotte

Laertis Economikos

Wayne Martin Moreau

Kenneth John McCullough

Charles Jesse Taft

John Patrick Simons

Xiaoyan Shao

Robert J Purtell

William Alfred Syverson

An apparatus and method designed to remove metals from a wafer surface using an electrolytic removal process. The apparatus includes a conductive pad having a plurality of alternating cathodes and anodes provided with a power source. The conductive pad is structured and configured to contact all metal islands on a surface of the wafer. Gaps are provided between pairs of the plurality of alternating cathodes and anodes.

Apparatus and method of electrolytic removal of metals from a wafer surface

A method and apparatus are provided for removing solid and/or liquid residues from electronic components such as semiconductor wafers utilizing liquid or supercritical carbon dioxide which is solidified on the surface of the wafer and then vaporized and removed from the system. In a preferred embodiment the solidification and vaporizing steps are repeated (cycled) before removal of the COfrom the vessel. The residues are carried away with the vaporized carbon dioxide.

Solid CO2 cleaning

Growing community of inventors

Hopewell Junction, NY, United States of America

Catherine Ivers