Thales

Thomson-Csf Sextant

Catherine Dupin

Daniel Laret

Alexandre Bataille

Nicolas Guiragossian

Christophe Venencie

The invention relates to the field of electronic devices with a thermally conducting encapsulant for draining away some of the energy dissipated by the electronic components contained in the electronic device. This is an electronic device comprising: a circuit () on which several electronic components () able to dissipate energy are placed; a thermal conducting cover () located opposite the circuit (); a thermally conducting encapsulant () placed between the circuit () and the cover () so as to ensure heat transfer, by conduction toward the cover (), of the energy dissipated in the components (); the respective surfaces of the encapsulant () and of the cover () which are facing each other including a number of substantially complementary recesses () and projections () allowing the cover () to fit into the encapsulant (), and gaps (j, j) being left between the recesses () and the projections () so as, on the one hand, to reduce the stress exerted by the cover () on the encapsulant () in the direction of the circuit () and on the other hand, to maintain the thermal conduction between the encapsulant () and the cover () above a given conduction threshold. The invention can be applied in particular to digital electronic cards.

Electronic device with heat conductive encasing device

A simplified-fitting modular helmet resistant to aerodynamic stresses. The helmet has a base helmet and module, and includes between these two parts two lateral linking devices and an upper linking device. The linking devices include a finger secured to the module inserted into a socket secured to the base helmet and latchable in the assembled position of the helmet by a device of the quarter of a revolution type. The lateral fingers permit a small lateral clearance between the two parts of the helmet. Such a helmet may find particular application as an aircraft pilot helmet.

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Talence, France

Catherine Dupin