Grundfos A/s

Casper Pedersen

Jens Peter Krog

Carsten Christensen

A pressure sensor is provided with a carrier (), which in an inner region includes a membrane () on which at least one first measurement element (R) for detecting a pressure impingement of the membrane () is arranged. Additionally, at least one second measurement element (R) for detecting a pressure impingement of the membrane () is arranged on the membrane. The first measurement element (R) and the second measurement element (R) are arranged distanced differently far from the edge of the membrane. The output signals of the first and the second measurement element (R, R) are evaluated together in a manner such that the two measurement elements (R, R) detect a differential pressure acting on the membrane (), and thereby compensate the influence of the system pressure acting on both sides of the membrane ().

Pressure sensor

The invention relates to a pressure sensor with a carrier (), which in an inner region comprises a membrane () on which at least one first measurement element (R) for detecting a pressure impingement of the membrane () is arranged, wherein additionally at least one second measurement element (R) for detecting a pressure impingement of the membrane () is arranged on the membrane, wherein the first measurement element (R) and the second measurement element (R) are arranged distanced differently far from the edge of the membrane, and the output signals of the first and the second measurement element (R, R) are evaluated together in a manner such that the two measurement elements (R, R) detect a differential pressure acting on the membrane (), and thereby compensate the influence of the system pressure acting on both sides of the membrane ().

The differential pressure sensor is formed of a semiconductor substrate () which is thinned out in an inner region into a membrane () which may be impinged by pressure on both sides. Measurement resistances (to) for detecting the differential pressure (Pminus P) are formed within the membrane (), and compensation resistances () are formed on the carrier, which are connected to measurement resistances (). The measurement resistances () are connected into a first measurement bridge () and the compensation resistances (to) into a second measurement bridge ().

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København, Denmark

Casper Pedersen