Intel Corporation

Casey R Winkel

Donovan D Van Sleet

Robert Fite

Tomm Aldridge

Jeffory L Smalley

Sandeep Ahuja

Eyran Eylon

Xiang Li

David Shia

Ralph V Miele

Barrett M Faneuf

Phil Geng

Robin A Steinbrecher

Michael Zack Eckblad

Kenan Huseyin Arik

Aaron P Anderson

Marc Milobinski

Brendan T Pavelek

Carlos Alvizo Flores

Fernando Gonzalez Lenero

Guixiang Tan

Minh T D Le

Ming Zhang

George Vergis

Devdatta P Kulkarni

Eric Dwight McAfee

Prabhakar Subrahmanyam

David S De Lorenzo

Kevin Ceurter

Shaorong Zhou

Ralph W Jensen

Ying-Feng Pang

Yi Xia

Feng Qi

Lianchang Du

Mohammed N Haq

Eric D Mcafee

Yuehong Fan

Jeffrey J Sopko

Yingqiong Bu

An apparatus is described. The apparatus includes a printed circuit board (PCB) dual in-line memory module (DIMM) connector having ejectors. The ejectors have a small enough vertical profile to permit unbent liquid cooling conduits to run across the DIMM's semiconductor chips.

Reduced vertical profile ejector for liquid cooled modules

An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Electronic systems with inverted circuit board with heat sink to chassis attachment

The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

Thermal control for processor-based devices

An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Embodiments are directed towards apparatuses, methods, and systems for a connector having a housing body to couple a dual in-line memory module (DIMM) to a printed circuit board (PCB). In embodiments, the housing body includes first and second opposing ends of the connector and a first and a second latch coupled at the respective first and second opposing ends of the connector to engage the DIMM. In embodiments, the first and the second opposing ends have respective first and second heights relative to a height of the housing body to allow the DIMM to be inserted or removed at an angle when disengaged from the first and second latch. In embodiments, one or more of the latches are removably coupled to the connector and/or can be rotated into a lay-flat position to allow the DIMM to be removed at an angle. Additional embodiments may be described and claimed.

Dual in-line memory modules (DIMM) connector towers with removable and/or lay-flat latches

Technologies for managing hot spots in a compute device with use of a vortex tube are disclosed. Cold air from one or more vortex tubes can be routed to hot spots of one or more compute devices, providing effective spot cooling. This approach may allow for cooling of components that might otherwise be difficult to cool, such as components where would be difficult or impossible to cool with a heat sink. This approach may also be effective in cooling components that are downstream of a heat sink and would otherwise only be cooled by air that was already heated by the heat sink.

Technologies for managing hot spots in a compute device

Embodiments herein relate to hydraulic bladders to provide a force against an integrated circuit package to be located between the hydraulic bladder and a system board. In various embodiments, a hydraulic force generator may include a block to be coupled with a system board and a hydraulic bladder to be located between the block and the system board, where the hydraulic bladder, in response to pressurization, is to provide a force against an integrated circuit package to be located between the hydraulic bladder and the system board. Other embodiments may be described and/or claimed.

Hydraulic bladder for CPU interconnection and cooling

In some embodiments a processor is adapted to store a relationship of power as a function of temperature and voltage, wherein the stored relationship data is to be used for managing power in a system including the processor. Other embodiments are described and claimed.

Power and thermal optimization of processor and cooling

A device is presented having an optical emitter/receiver device. The device has a light pipe connected with the optical emitter/receiver device. Also a rotating shaft having at least one opening. The light pipe is situated within the rotating shaft. At least one bearing having a reflective marker is connected to the shaft.

Method and apparatus for detecting bearing failure

A portion of a chassis comprised of a material forming a portion of the exterior of the chassis and a high-density flexible material adjacent an inner surface of the portion of the chassis with air holes formed contiguously through both the portion of the chassis and the high-density flexible material.

Acoustically insulated bezel

A device is presented having a multiplicity of motors connected to a shaft. A multiplicity of motor control devices are connected to the motors. A multiplicity of bearings are connected to the motors and the shaft. The multiplicity of motors, the multiplicity of motor control devices and the multiplicity of bearings continue to control the shaft rotation speed upon failure of either one of the multiplicity of motors, the multiplicity of motor control devices, or the multiplicity of bearings. Also presented is a device having at least one motor connected to a shaft. At least one bearing is connected to the at least one motor and the shaft. The at least one bearing has a multiplicity of rotating sleeves.

Method and apparatus for fan redundancy

A heat dissipation device having an integral load centering mechanism adapted to provide a location for contact between a spring clip and the heat dissipation device. The load centering mechanism is located in an area on the heat dissipation device which will provide a centered loading to a microelectronic die and constitutes substantially the only place where the spring clip contacts the heat dissipation device when the spring clip is providing a force against the heat dissipation device.

Heat dissipation device having a load centering mechanism

A device is presented having at least one power supply. The power supply is connected to a power supply fan. A first power source terminal is connected to the at least one power supply. A second power source terminal is connected to the at least one power supply. The power supply fan is powered from a source external to the at least one power supply.

Power and control for power supply fans

A bearing is presented having a multiplicity of rotating sleeves. A bushing is connected to one of the multiplicity of rotating sleeves. At least one bearing set is connected to the multiplicity of rotating sleeves. Also, a bearing is presented having a multiplicity of rotating sleeves. At least two bearing sets are connected to the multiplicity of rotating sleeves. Another bearing is presented having a multiplicity of rotating sleeves. At least two bearing sets are connected to the multiplicity of rotating sleeves. A bushing is connected with one of the rotating sleeves.

Growing community of inventors

Olympia, WA, United States of America

Casey R Winkel