Lam Research Corporation

Casey Holder

Kevin M McLaughlin

Bart Jan Van Schravendijk

Bhadri N Varadarajan

Akhil N Singhal

Ananda K Banerji

Joseph Hung-chi Wei

George Andrew Antonelli

Curtis Warren Bailey

James Forest Lee

Andrew John McKerrow

Eugene Smargiassi

Stephen Lau

Alexander R Fox

Troy Daniel Ribaudo

Xiaolan Chen

Methods and apparatuses suitable for encapsulation layers for memory devices at temperatures less than about 300&#xb0; C. are provided herein. Methods involve introducing a reactive species by pulsing plasma while exposing a substrate to deposition reactants, and post-treating deposited encapsulation films to densify and reduce hydrogen content. Post-treatment methods include periodic exposure to inert plasma without reactants and exposure to ultraviolet radiation at a substrate temperature less than about 300&#xb0; C.

Methods of encapsulation

Methods and apparatuses suitable for depositing low hydrogen content, hermetic, thin encapsulation layers at temperatures less than about 300&#xb0; C. are provided herein. Methods involve pulsing plasma while exposing a substrate to deposition reactants, and post-treating deposited encapsulation films to densify and reduce hydrogen content. Post-treatment methods include periodic exposure to inert plasma without reactants and exposure to ultraviolet radiation at a substrate temperature less than about 300&#xb0; C.

Apparatuses and methods for cleaning a semiconductor processing chamber is provided. The semiconductor processing chamber may include a UV radiation source, a substrate holder, and a UV transmissive window. The UV transmissive window may include one or multiple panes. One or more panes of the UV transmissive window may be non-reactive with fluorine containing chemistries. In multi-pane windows a purge gas flow path may be formed in the gap between windows. A purge gas may be flowed through the purge gas flow path to prevent process gases used in the chamber interior from reaching one or more panes of the UV transmissive window.

Clean resistant windows for ultraviolet thermal processing

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Oakland, CA, United States of America

Casey Holder