International Business Machines Corporation

Cary Huettner

Joseph Paul Kuczynski

Don Alan Gilliland

Timothy Jerome Tofil

Robert E Meyer, Iii

Roger R Schmidt

William James Anderl

Mark David Plucinski

Matthew Carl Zehrer

Madhusudan K Iyengar

Michael D O'Connell

Kenneth Robert Schneebeli

Gerard Vincent Weber, Jr

Alan Claassen

Dennis John Hansen

Eric Alan Eckberg

Patrick Kevin Egan

James Dorance Gerken

Dennis James Wurth

Maurice Francis Holahan

Kyle Gilbertson

Mark David Pfeifer

Kenneth E Lubahn

Jessica Rose Berens

Nathan David Karl

Blair Wyman

Max John Christopher Koschmeder

Jeffrey L Justin

Paul Jeffrey La Rocca

Gregory Scott Vande Corput

Kenneth Robert Peters

Max J C Koschmeder

Aaron C Evans

Igar Shepelev

Jim Coon

Embodiments of the present invention are directed to a computer-implemented method for serving content. A non-limiting example of the computer-implemented method includes identifying, using a processor, a first user and a second user among a group of users viewing a display. Next, the method includes examining, using the processor, known information about the first user and the second user. The method includes computing a content profile, using the processor, based on the known information about the first user and the second user. The method further includes selecting relevant content, using the processor, to display to the group based on the content profile and presenting, using the processor, the relevant content to the group of users.

Targeted content for simultaneous multi-users for a shared device

Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances.

Endothermic reaction apparatus for removing excess heat in a datacenter

An apparatus for cooling a heat-generating component is disclosed. The apparatus includes a cooling chamber containing a liquid metal. The cooling chamber has a heat-conducting wall thermally coupled to the heat-generating component. A plurality of extendable tubes making up an array of cooling pin fins is attached to the cooling chamber. Each of the extendable tubes has a port end that opens into the cooling chamber and a sealed end that projects away from the cooling chamber. Moreover, each of the extendable tubes has an extended position when filled with liquid metal from the cooling chamber and a retracted position when emptied of the liquid metal. A pump system is included for urging the liquid metal from the cooling chamber into the plurality of extendable tubes.

Heat sink apparatus with extendable pin fins

A card connector having a housing with a receiving slot and connector pins are provided. An expansion card having docking well regions, contact pads, and backup contact pads is inserted in the receiving slot. The connector pins are connected to the docking well regions on the expansion card. The expansion card is coupled to a servomechanical device that can slide the expansion card to connect the connector pins with the contact pads. Connector pins and contact pads are coated with an interface material that is subject to wearing. Worn interface material can cause weak electrical connections between connector pins and contact pads. Thus, a card connector with a servomechanical device is provided to slide an expansion card within a receiving slot of the card connector for an improved electrical connection between connector pins and contact pads.

Card connector with a servomechanical device for repositioning an expansion card

A method, system and computer program product are provided for implementing dynamic noise elimination. A system frame includes a plurality of acoustical sensory devices monitoring the system for problem frequencies. The system frame includes a plurality of tubes. When the tube is open, airflow is allowed. When identified tubes are closed, quarter-wavelength attenuation is provided for a frequency in a range of frequencies, based upon a length of the tube when closed. Each of the plurality of tubes is selectively controlled to be operable open or closed at a particular length, responsive to identified problem frequencies.

Implementing dynamic noise elimination with acoustic frame design

An apparatus, method and computing device including a card edge contact system is provided. A card edge connector housing for receiving a card is provided. A substrate is provided and spaced a distance away from a housing base portion of the card edge connector housing to form a space therebetween. Contact pins collectively defining an upper contact section, a lower contact section and a compliant section connecting the upper and lower contact sections are disposed within the card edge connector housing and the substrate. The upper contact section has an open end with a restricted contact portion for contacting the card. The resilient, compliant section is disposed within the space and is configured to compress to absorb a force from the substrate that would otherwise be transmitted to the upper contact section via the lower contact section.

Connector with compliant section

A rack mount assembly measurement tool, for determining physical values including air flow and heat loads, includes a front assembly and a rear duct assembly that are non-intrusively and releasably mounted on the front and rear of such rack mount enclosure. Physical values are sensed at multiple vertical locations to enable a determination of overall and localized heat loads within the enclosure. Front sensor values are collected and wirelessly transmitted from the front assembly to a receiver/processor supported on the rear duct, which generates computed values that are displayed in addition to the sensed values.

Heat flow measurement tool for a rack mounted assembly of electronic equipment

An electronic device cabinet includes a first temperature control system positioned to direct a conditioned airflow into a first electronic device storage zone of the cabinet and a second temperature control system positioned to direct a conditioned airflow into a second electronic device storage zone of the cabinet. The first temperature control system includes a first plurality of vortex tubes having a compressed air inlet and a first cooling air outlet that guides cooling air into the first device storage zone. The second temperature control system includes a second plurality of vortex tubes having a compressed air inlet and a second cooling air outlet that guides cooling air into the second device storage zone. A controller selectively delivers compressed air to respective ones of the first and second temperature control systems upon sensing a demand for cooling in corresponding ones of the first and second electronic device storage zones.

Temperature control system for an electronic device cabinet

A tool is disclosed, for measuring the important thermal characteristics of a unit of electronic equipment, which obtains air flow and temperature readings at both air inlet and air outlet openings of the unit without disturbing cable or wiring connections or otherwise interrupting device operation. The tool pressure sensing element is rotatable between detented positions to permit the tool to be used at both air inlet and air outlet openings. The tool air duct portion may be formed of separate duct portions to enable a single duct portion including the sensing instrumentation to be used with multiple duct portions that conform to electronic device air inlet and outlet openings to impart added flexibility to the tool.

Bidirectional and expandable heat flow measurement tool for units of air cooled electrical equipment

A heat exchanger for use, e.g., in a rear door of a server rack in a computer room, made up of pipes clad with a layer of a phase change material, such as a paraffin, so that latent heat is absorbed in the conversion from the solid to the liquid state. Preferably, each pipe in turn is opened by a control valve and chilled coolant flows through the pipe until the phase change material reverts back to the solid state. Then, the control valve is again closed, and the phase change material is further heated by waste heat so that it is melted once more. Preferably, the control valve for only one pipe at a time is opened, so that latent heat is being absorbed by the phase change material around all pipes but one.

Cooling system employing a heat exchanger with phase change material, and method of operation thereof

The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Real time adaptive active fluid flow cooling

An attenuation mechanism for an electronic device is presented. The attenuation mechanism includes an outer member that has an inner member oriented axially within the outer member. The inner member has an axial twist that causes a line of sight blockage between an exterior and an interior of a housing of an electronic device when the attenuation mechanism is mounted through the housing, such that sound and electromagnetic radiation is attenuated without obstructing cooling air that is flowing through the housing.

Air exhaust/inlet sound attenuation mechanism

An assembly, system, and method particularly adapted for a magnetic resonator apparatus in a magnetic resonance imaging (MRI) scanning system. Provided is a restraining assembly supportable by the supporting assembly and including at least a system that is selectively operable for positioning and restraining at least a portion of the body to be imaged, thereby optimizing image quality.

Assembly, system, and method for optimizing image quality

A card edge connector assembly with a housing with side walls and a housing base portion embodying an unique card edge auto thickness detection mechanism that includes a pair of movable block members with interconnected upstanding auto thickness detection members and contact pins, a pair of spring members positioned between the movable blocks and interior wall portions of the housing and a pair of stabilizing tie rod members cooperatively associated with the movable blocks for allowing translational movement, while preventing rotation. Each movable block having an extending projection slidably received within longitudinal channels formed in the base housing portion for maintaining the auto thickness detection mechanism in a selected position. Upon insertion of PCI cards between the contact pins and the auto thickness detection members, the contact pins and the auto thickness detection members are moved away from one another against the spring members for accommodating card edges of varying thicknesses.

Growing community of inventors

Rochester, MN, United States of America

Cary Huettner