Motorola Corporation

Cary B Powell

Francis J Carney, Jr

George F Carney

Douglas G Mitchell

Eric J Woolsey

Marion I Simmons

A method of manufacturing electronic components includes disposing a top metal layer ( ) comprised of solder over a bottom metal layer ( ) comprised of titanium or tungsten, and selectively etching the bottom metal layer ( ) over the top metal layer ( ) with an etchant mixture ( ) comprised of an etchant, an additive to control the temperature of the etchant mixture ( ), and another additive to reduce the redeposition of the top layer ( ).

Method of manufacturing electronic components

A method for improving the bonding characteristics of TAB semiconductor packages to circuit boards is achieved by plating additional amounts of tin on the TAB semiconductor package leads after final package assembly is complete. Residues from the plating step are removed from the package assembly to prevent contamination. Stresses that were developed in the plated material during the plating step are removed by heating the leads.

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Tempe, AZ, United States of America

Cary B Powell