Henkel Ag & Company, Kgaa

Carsten Schubert

Siegfried Kopannia

Ruediger Butterbach

Judith Siepenkothen

Patrick Markiefka

Rüdiger Butterbach

The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive compositions of the invention comprise at least one (co)polymer binder and combination of different fillers, as defined herein.

Thermally conductive adhesive

A reactive hotmelt adhesive comprising two components A and B each containing one or more polymers A or B having different functional groups, these groups being able to react with one another under the influence of temperature, and i) the mutually reactive functional groups are selected from hydroxyl, amine, carboxylic acid, anhydride and epoxide groups, ii) unreactive polymers and/or additives are present in at least one of the components, iii) the components are present in spatially separate regions, the adhesive having a first temperature range between 80 and 150&#xb0; C. in which the components melt and are miscible with one another without reaction of the functional groups with one another, and the adhesive having a second temperature range between 130 and 190&#xb0; C. in which it can melt and chemically crosslink, the second temperature being above the first temperature.

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Duesseldorf, Germany

Carsten Schubert