Linxens Holding

Smartrac Technology Gmbh

Other

Dresden Gmbh

Linxens Holding Sas

Carsten Nieland

Frank Kriebel

Christophe Mathieu

Lars Klemm

Sven Doering

Laurence Singleton

Somchard Phannam

Sebastian Gallschütz

Sven Döring

Fycommee Akkadech

Hannes Kullig

Stephan Dorn

Olivier Thienard

Martin Häring

Hannes Kuellig

In aspects, the present invention relates to a wire pad design of a connection pad in a prelam body of a smart card, to a prelam body with at least one such connection pad embedded into a substrate, to a smart card comprising such a prelam body, to a method of forming a wire pad design of a connection pad of a prelam body of a smart card, and to a method of forming a smart card. In some illustrative embodiments, a wire pad design of a connection pad in a prelam body of a smart card is provided, the wire pad design comprising a connection pad wiring pattern formed by plural wire portions extending in a contacting pad plane, and a bridging wire portion which at least partially extends outside the contacting pad plane. The bridging wire portion electrically and mechanically connects at least some of the plural wire portions with each other.

Wire pad design of a connection pad in a prelam body of a smart card, prelam body, smart card, method of forming a wire pad design, and method of forming a smart card

When forming smartcards or pre-forms thereof additional functionality may be implemented by, for instance, incorporating components, such as a display device, and the like, by preparing pre-packages separately from the rest of the pre-forms and subsequently inserting the pre-packages into the pre-forms, thereby achieving superior process robustness and production yield.

Pre-package for a smartcard, a smartcard and a method of forming the same

The present invention relates in various aspects to a module for integrating into card body of a smart card, to a smart card, and to a method of implanting a module into a card body of a smart card. In an aspect, a module for integrating into a card body of a smart card comprises a support, a contact portion formed on a first surface of the support, and a solder material formed on the contact portion, wherein a surface of the solder material is at least partially covered by a flux.

Module for integrating into a card body of a smart card, smart card, and method of implanting a module into a card body of a smart card

In various aspects, the present invention relates to a lead frame for integration into a smart card, a card body of a smart card, a smart card, and a method of forming a smart card. In an aspect of the present disclosure, a lead-frame for integration into a smart card is provided comprising a planar lead-frame body portion, at least one contact pad having a planar contact portion, and at least one bridging portion coupled with the planar lead-frame body portion and extending away from the planar lead-frame body towards the at least one contact pad and between the planar contact portion and the planar lead-frame portion, wherein the at least one bridging portion extending out of a plane defined by at least one of the planar lead-frame body portion and the planar contact portion and at least partially in parallel to a substantially normal direction of the planar contact portion.

Lead-frame, card body of a smart card, smart card, and method of forming a smart card

Biometric sensor module for a chip card, and method for producing such a module. Method for producing a biometric sensor module for a chip card, including steps of providing a dielectric carrier including a front face and a back face, both forming main faces of the carrier, attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite a detection area on the front face, producing electrically conductive connection pads on the back face of the carrier which are electrically connected to the biometric sensor, at least one connection pad includes a region that is wettable with a solder material, extending over an area of between 0.2 and 5 square millimetres.

Biometric sensor module for a smart card and method for manufacturing such a module

The present disclosure provides in various aspects for a method of forming a prelam body of a smart card and a prelam body of a smart card. In some illustrative embodiments, a prelam body of a smart card comprises at least one contact terminal patch, which comprises a patch base layer and a plurality of conductive pads provided on a surface of the patch base layer, wherein the plurality of conductive pads is arranged on the patch base layer in accordance with a predefined interconnection design, and a prelam sheet with a plurality of openings, each opening accommodating a dedicated one of the conductive pads, wherein the at least one contact terminal patch is mounted to the prelam sheet.

Method of forming a prelam body of a smart card, a method of forming a smart card, a prelam body, and a smart card

When forming layer stacks in the presence of solder material, uncontrolled flow of the solder material at the interface of two different layers of the layer stack may significantly be mitigated by providing an area of increased pressure in the material of the overlaying foil layer. For example, the area of increased pressure may be generated during the lamination process by providing a pressure inducing structure, for instance on the underlying foil layer, which laterally surrounds the solder material and therefore, in combination with the material of the overlying foil layer, reliably confines the solder material.

Laminated foil structure and method of forming the same

A transponder apparatus for a transponder unit has a UHF and HF transponder The UHF transponder has a transponder support, a UHF antenna and a UHF chip. The HF transponder has an HF antenna and an HF chip. The UHF antenna is at the transponder support and is made up of conducting UHF antenna structures in transponder support planes which are spatially separated from one another. The transponder apparatus includes an electrically-insulating attachment layer connecting the UHF transponder to the HF antenna. The transponder apparatus includes an electrically-insulating spacer element connected to the HF transponder and which spatially separates the UHF transponder and the HF transponder relative to a body. The UHF transponder is disposed on the HF antenna. A conducting HF antenna structure of the HF antenna extends beyond a covering surface of the UHF transponder and the HF antenna structure.

Transponder apparatus

The invention relates to a contact bump connection () and to a method for producing a contact bump connection between an electronic component being provided with at least one terminal face () and a contact substrate () being contacted with the component and having at least one second terminal face (), wherein the first terminal face is provided with a contact bump (), which has a raised edge () and has at least one displacement pin () in a displacement compartment () being surrounded by the raised edge and being open towards a head end of the contact bump, and wherein, in a contact region () with the first terminal face, the second terminal face has a contact bead (), which is formed by displacement of a contact material () of the second terminal face into the displacement compartment and which surrounds the displacement pin, said contact bead having a bead crown () which is oriented to a bottom () of the displacement compartment and is raised relative to a level contact surface () of the second terminal face surrounding the contact region.

Contact bump connection and contact bump and method for producing a contact bump connection

The invention relates to a method for producing chips () by dividing a wafer along dividing lines () defining dimensions of the chip, wherein a focus () of a preferably pulsed laser radiation () is moved along the dividing lines on a first and at least a second path () within the wafer body, wherein the laser radiation is applied to the wafer from a rear side () of the wafer, and the power density for producing the defects () on the first path () is lower than the power density for producing the defects () on the second path (), and/or the number of defects on the first path is smaller than the number of defects on the second path.

Method of separating chips from a wafer

Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.

Contact bumps methods of making contact bumps

A magnetic-guiding laminate is used to improve wireless communication between a transmitter and a receptor disposed on a substrate, regardless of the substrate materials. The laminate can comprise one or more layers of magnetic or non-magnetic material with different magnetic property. For example, the laminate can comprise a paramagnetic layer disposed on a diamagnetic layer, where the paramagnetic layer attracts the magnetic field toward the RFID antenna, and the diamagnetic layer prevents the magnetic field from dispersing in the substrate. Alternatively, the laminate can comprise multiple paramagnetic layers, wherein at least two layers have different magnetic properties, such as different permeability values.

Growing community of inventors

Gotha, Germany

Carsten Nieland