Nxp B.v.

Caroline Catharina Maria Beelen-Hendrikx

Roelf Anco Jacob Groenhuis

Tonny Kamphuis

Leonardus Antonius Elisabeth Van Gemert

Jetse De Witte

Franciscus Henrikus Martinus Swartjes

Leo Van Gemert

Jeroen Johannes Maria Zaal

One example discloses a component carrier, including: a cavity; wherein the cavity includes a set of cavity registration features configured to engage with a set of component registration features on a component; and wherein the cavity registration features are within the cavity.

Component carrier

Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

Reduction of defects in wafer level chip scale package (WLCSP) devices

Reducing defects in wafer level chip scale package (WLCSP) devices

Presented is an integrated circuit packaged at the wafer level wafer (also referred to as a wafer level chip scale package, WLCSP), and a method of manufacturing the same. The WLCSP comprises a die having an electrically conductive redistribution layer, RDL, formed above the upper surface of the die, the RDL defining a signal routing circuit. The method comprises the steps of: depositing the electrically conductive RDL so as to form an electrically conductive ring surrounding the signal routing circuit; and coating the side and lower surfaces of the die with an electrically conductive shielding material.

Integrated circuit and method of manufacturing the same

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Nijmegen, Netherlands

Caroline Catharina Maria Beelen-Hendrikx