Siemens Aktiengesellschaft

Osram Opto Semiconductors Gmbh

Siemens Mobility Austria Gmbh

Caroline Cassignol

Karl Weidner

Walter Wegleiter

Georg Dirscherl

Stefan Stegmeier

Erik Weisbrod

Dulijano Pecanac

Laszlo Boronkai

Oliver Raab

Alexander Hensel

Various embodiments include a method for producing a least one conductive track comprising: forming a surface with a thermoplastic; and depositing conductive track material on the surface by thermal spraying.

Method for producing conductive tracks, and electronic module

A ballistic protection arrangement for vehicles, in particular for rail vehicles chassis, with at least one first wheelset which has a first wheel, a second wheel and a wheelset shaft, wherein in order to provide advantageous construction conditions, a shell includes at least one first material layer, which includes a first fibre material, arranged around the wheelset shaft such that the wheelset shaft is advantageously protected from damage, for example, due to stone impacts at particularly high travelling speeds and at particularly low temperatures, where the first fibre material of the first material layer brings about high absorption of energy with the protection arrangement while, at the same time, having a low mass.

Ballistic protection arrangement for vehicles

The invention relates to an optoelectronic semiconductor component, which has a carrier element (), on which an optoelectronic semiconductor chip () having at least one active layer is arranged, wherein the active layer is designed to emit or receive light during operation and wherein the semiconductor chip () is covered with a protective layer () that contains poly-para-xylenes.

Optoelectronic semiconductor component

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Munich, Germany

Caroline Cassignol