Amazon Technologies, Inc.

Caroline Anne Keely

Gregory Cartagena

Dincer Bozkaya

Gabriel Hebert

Sara Jean Woo

Jonathan Lee Zerez

Techniques and apparatus for mechanical assembly of an imaging device are described. An example image sensor assembly disposed within an imaging device includes a circuit board, an image sensor disposed on the circuit board, and an optics holder. The optics holder includes a support location, a thermally conductive material, and a plurality of extended surfaces that extend outward in a direction away from the circuit board. Each of the plurality of extended surfaces includes the thermally conductive material. The image sensor assembly also includes an optical lens disposed in the support location of the optics holder. The circuit board is disposed between the optics holder and a housing of the imaging device.

Mechanical assembly for camera systems

Embodiments describe techniques for controlling picking robots to retrieve items on the floor and return them to an appropriate location. In one embodiment, the picking robots wait until a sensor in a monitored area (e.g., a designated robot area or an area around a pick/stow station) detects a dropped item on the floor. A central control system then dispatches the picking robot to the location to retrieve the dropped item. In another embodiment, when not being dispatched, the picking robots patrol the area looking for dropped items.

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Wakefield, MA, United States of America

Caroline Anne Keely