Intel Corporation

Carolina Garcia Robles

Beom-Taek Lee

Raul Enriquez Shibayama

Raul Enriquez-Shibayama

Techniques and mechanisms for facilitating connection between a packaged device and a substrate of another device. In an embodiment, a device&#x2014;such as a printed circuit board&#x2014;comprises a substrate and a hardware interface at a first side of the substrate, the hardware interface to couple the device to a package including integrated circuitry. The device is further configured to couple to a bridge device via contacts disposed at a second side of the substrate. An interconnect extends from the hardware interface to one of the contacts at the second side. In another embodiment, coupling the substrate to the bridge device interconnects two of the contacts at the second side to one another via the bridge device, where one or more contacts of the hardware interface (e.g., only a subset of all such contacts) are also interconnected with the bridge device via the second side.

Apparatus, system, and method including a bridge device for interfacing a package device with a substrate

A bridge device is described herein. The bridge device may include a first via of a bridge device, the first via of the bridge device having a short via stub or no via stub, the first via of the bridge device to be communicatively coupled to a first via of a printed circuit board (PCB). The bridge device may include a second via of the bridge device, the second via of the bridge device having a short via stub or no via stub, the second via of the bridge device to be communicatively coupled to a second via of the PCB. A trace of the bridge device may communicatively couple the first via of the bridge device to the second via of the bridge device.

Growing community of inventors

Tlaquepaque, Mexico

Carolina Garcia Robles