Akzo N.v.

Carolina A Dirix

Henricus P Willemsen

Eleanor Van Andel

Theodorus G Te Boekhorst

A semiconductor module with provisions for improved cooling and interconnection so as to allow for maximum chip packaging density. Air cooling is brought about by a zig-zag arrangement of groups of thin wire cooling fins mounted on a heat dissipating conductor unit also providing the necessary mechanical rigidity of the module. The interconnection comprises a layer containing grains, preferably diamond, leaving high electrically insulating and high thermally conductive properties.

Semiconductor module having projecting cooling fin groups

A heat exchanging member, more particularly for cooling a semiconductor module, having at a first and a second side, respectively, inlets and outlets, respectively, for a preferably gaseous heat exchanging medium, and having a heat exchanging component made of a highly thermal conductive material, such as metal, in which channels disposed side by side and running from its inlet side to its outlet side have been formed, such that medium flowing in through the inlet channels is constrained to flow at an angle to the direction of entry via the heat exchanging material to the adjacent outlet channels, characterized in that the heat exchanging material has a structure which comprises packed parts including:

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Westervoort, Netherlands

Carolina A Dirix