Marvell Israel (misl) Ltd.

Carol Pincu

Ido Bourstein

Abed Tatour

Aspects of the disclosure provide an integrated circuit (IC) formed on a die. The IC includes first one or more electronic circuits and a seal ring structure. The first one or more electronic circuits are disposed on a first semiconductor substrate. The first semiconductor substrate is diced from a semiconductor wafer. The seal ring structure is configured to surround the first one or more electronic circuits. The seal ring structure is formed by patterning one or more layers of metal compounds on the semiconductor wafer using two or more circuit formation process steps. The seal ring structure includes a remaining portion of a complete seal ring structure after a dicing process step that cuts the complete seal ring structure. The complete seal ring structure has been formed on the semiconductor wafer to surround the first one or more electronic circuits and at least second one or more electronic circuits on a second semiconductor substrate that is diced from the semiconductor wafer.

IC die having patterned seal rings

Aspects of the disclosure provide an integrated circuit (IC) formed on a die. The IC includes first one or more electronic circuits and a seal ring structure. The first one or more electronic circuits are disposed on a first semiconductor substrate. The first semiconductor substrate is diced from a semiconductor wafer. The seal ring structure is configured to surround the first one or, more electronic circuits. The seal ring structure is formed by patterning one or more layers of metal compounds on the semiconductor wafer using two or more circuit formation process steps. The seal ring structure includes a remaining portion of a complete seal ring structure after a dicing process step that cuts the complete seal ring structure. The complete seal ring structure has been formed on the semiconductor wafer to surround the first one or more electronic circuits and at least second one or more electronic circuits on a second semiconductor substrate that is diced from the semiconductor wafer.

On-die seal rings

Systems and methods are provided for an interposer for coupling two or more integrated circuit dies to a circuit package. A first integrated circuit portion is disposed on a first location of a single semiconductor substrate. A second integrated circuit portion is disposed on a second location of the single semiconductor substrate, where the second integrated circuit portion is electrically isolated from the first integrated circuit portion along a first axis. The first and second integrated circuit portions are configured to provide an electrical coupling to two or more corresponding top die integrated circuits across a second axis that is perpendicular to the first axis.

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Rishon LeTsiyon, Israel

Carol Pincu