Advanced Micro Devices Corporation

Carol M Bradway

Khoi A Phan

Jeffrey P Erhardt

Martin Mazur

Jerry Cheng

Wolfram Grundke

Richard J Bartlett

Daniel E Sutton

Anthony P Coniglio

Methods and systems are disclosed for reducing resist residue defects in a semiconductor manufacturing process. The methods comprise appropriate adjustment of hardware, substrate, resist, developer, and process variables in order to remove resist residues from a semiconductor substrate structure in order to reduce resist residue defects therein, including special vapor prime and development operations.

Methods and systems for controlling resist residue defects at gate layer in a semiconductor device manufacturing process

Methods and systems are disclosed for reducing resist residue defects in a semiconductor manufacturing process. The methods comprise appropriate adjustment of hardware, substrate, resist, developer, and process variables in order to remove resist residues from a semiconductor substrate structure in order to reduce resist residue defects therein. The method may comprise employing an anti reflective coating prior to applying a photo resist coating in a semiconductor manufacturing process. Also disclosed are methodologies for exhausting resist residue during development via a rinsing fluid.

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Austin, TX, United States of America

Carol M Bradway