Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Carol Corder

Michelle K Jensen

John Gifford Nowland

Brenda Harding

A method for making a multilayer chemical mechanical polishing pad comprising: providing a polishing layer, providing a subpad layer, optionally providing additional layers, providing an unset reactive hot melt adhesive, applying the unset reactive hot melt adhesive in a pattern on a surface of at least one of the layers, applying one of the other layers over the pattern of unset reactive hot melt adhesive, pressing the two layers together with the unset reactive hot melt adhesive interposed therebetween, allowing the unset reactive hot melt adhesive to set forming a reactive hot melt adhesive bond between the two layers.

Multilayer chemical mechanical polishing pad manufacturing process

A method of manufacturing a chemical mechanical polishing pad is provided, comprising: providing a polishing layer; providing a chemical mechanical polishing pad manufacturing assembly, comprising: a subpad layer having a top surface, a bottom surface and at least two wrap around tabs; a backing plate having a top side and a bottom side; a sacrificial layer having at least two recessed areas designed to facilitate attachment of the subpad layer to the backing plate; an unset reactive hot melt adhesive applied to the top surface of the subpad layer, wherein the unset reactive hot melt adhesive is applied in a pattern of parallel lines; wherein the subpad layer is disposed on the top side of the backing plate and the sacrificial layer is disposed on the bottom side of the backing plate, and wherein the at least two wrap around tabs extend to the bottom side of the backing plate; stacking the polishing layer and the chemical mechanical polishing pad manufacturing assembly with the unset reactive hot melt adhesive interposed between the polishing layer and the subpad layer forming a stack; applying an axial force to the stack; allowing the unset reactive hot melt adhesive to set forming a reactive hot melt adhesive bond between the subpad layer and the polishing layer; separating the at least two wrap around tabs from the subpad layer; and, removing the subpad layer with the polishing layer bonded thereto from the backing plate.

Method of manufacturing a chemical mechanical polishing pad

A chemical mechanical polishing pad manufacturing assembly is provided having a subpad layer having a top surface and a bottom surface; a backing plate having a top side and a bottom side; a sacrificial layer having at least two recessed areas designed to facilitate attachment of a subpad layer to the backing plate; wherein the subpad layer is disposed on the top side of the backing plate and the sacrificial layer is disposed on the bottom side of the backing plate, and wherein the at least two wrap around tabs extend to the bottom side of the backing plate. Also provide is a method of manufacturing a chemical mechanical polishing pad using the chemical mechanical polishing pad manufacturing assembly.

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Elk Mills, MD, United States of America

Carol Corder