Harris Corporation

Carol Ann Gamlen

Charles Michael Newton

Raymond Charles Rumpf

Paul Bryant Koeneman

Randy T Pike

Steven Robert Snyder

Michael D Pleskach

John Richard Desalvo

Gregory Michael Shimkaveg

William Thomas Silfvast

Betty O'Dowd

Brian Ronald Smith

Raymond C Rumpf, Jr

Mihael Pleskach

Raymond Rumpf

William Thonas Silfvast

William T Silfvast

A pixel array arrangement is provided for a soft x-ray source. The arrangement includes: a window-frame structure having a plurality of channels passing therethrough, where each channel forms a pixel for the x-ray source; a cathode disposed on one side of each channel in the window-frame structure and operable to emit electrons into the channel; and an anode disposed in each cavity on an opposing side of the channel from the cathode and operable to emit x-ray radiation when electrons from the cathode impinge thereon, where the anode is configured to emit x-ray radiation at a diffused angle such that the x-ray radiation from a given pixel overlaps with x-ray radiation from adjacent pixels.

Pixel array arrangement for a soft x-ray source

An electro-fluidic interconnection. The interconnection includes a body () formed of a ceramic material. The body () is provided with an aperture () having a profile suitable for receiving an interconnecting conduit (). The interconnecting conduit () can be formed of the same type of ceramic material as the body (). The conduit () is defined by an outer shell () with a hollow bore () for transporting a fluid. A mating portion () of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion () of the conduit () can be compression fitted within the aperture (). Conductive traces () on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.

Electro-fluidic interconnect attachment

A method is provided for decontaminating biological pathogens in a contaminated environment. The method includes: tailoring x-ray radiation to match the absorption characteristics of a contaminated environment; generating x-ray radiation having a diffused radiation angle in accordance with the absorption characteristics of the contaminated environment; and directing the x-ray radiation towards the contaminated environment.

Soft x-ray radiation for biological pathogen decontamination and medical sterilization applications

A microelectromechanical structure and method is disclosed. A ceramic substrate preferably is formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can e a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. In one aspect of the invention, a switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.

Ceramic microelectromechanical structure

A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.

Method for making electronic devices including silicon and LTCC and devices produced thereby

An electro-fluidic device may include a substrate having at least one substrate fluid passageway therein, and at least one substrate electrical conductor carried by the substrate. Moreover, an external interface may be spaced from the substrate and include at least one interface electrical conductor. The electro-fluidic device may also include at least one electro-fluidic interconnect extending between the substrate and the external interface. More particularly, the at least one electro-fluidic interconnect may include an interconnect body having at least one interconnect fluid passageway extending therethrough and connected to the at least one substrate fluid passageway, and at least one interconnect electrical conductor carried by the interconnect body. The at least one interconnect electrical conductor may connect the at least one substrate electrical conductor and the at least one interface electrical connector.

Electro-fluidic device and interconnect and related methods

A microelectromechanical structure and method is disclosed. A ceramic substrate preferably is formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can be a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. In one aspect of the invention, a switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.

A thermally enhanced microcircuit package includes a microcircuit package having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid. The evaporator is operatively associated with the microcircuit device for cooling the device when in use.

Growing community of inventors

Melbourne, FL, United States of America

Carol Ann Gamlen