Stratos Lightwave, Inc.

Stratos International, Inc.

Carlos Jines

Patrick B Gilliland

Raul Medina

Robert M Dwarkin

Theodore Washburn

James W McGinley

Gregg R Rapala

Scott C Erickson

Anastasia Bardouniotis

An interface converter module includes a metallized housing having a first end and a second end. A printed circuit board is mounted within the housing and has mounted thereon electronic circuitry configured to convert data signals from a host device transmission medium to the second transmission medium. The printed circuit board has not more than twenty contact fingers adhered at one end in order to form a host connector, a media connector is at the other end of the module. The media end having a dual LC duplex optical receptacle, where each duplex portion of the dual LC duplex optical receptacle houses a ROSA and a TOSA. The module and receiver may include interengaging rails and slots and/or keys and keyways to ensure correct matching of modules and receptacles.

Multi-port pluggable transceiver (MPPT) with multiple LC duplex optical receptacles

A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an edge emitting optical diode, a reflecting mirror, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto.

Small format optical subassembly

An optoelectronic device includes two optical subassemblies mounted on an edge of a substrate. Electronic circuitry is mounted on the substrate. The two optical packages are electrically connected to the electrical circuitry. An optical coupling element is attached to one of the optical packages and another optical coupling element is attached to the other optical package. A rib is attached to the substrate and to one of the optical coupling elements so as to provide support for the optical coupling element, and another rib is attached to the substrate and to the other optical coupling element. Each optical coupling element has a respective ferrule receiving bore. The ferrule receiving bores are parallel to one another. A connection pin header is electrically connected to the electronic circuitry on the substrate. The connection pin header includes connection pins.

Dual channel device having two optical sub-assemblies

A device which is surface mountable to a printed circuit board. The device includes a housing, an optical sub-assembly, and an electrical connector. The housing includes a fiber optic connector receptacle and a bottom side. The housing is made of an electrically conductive material. The optical sub-assembly is associated with the fiber optic connector receptacle. The electrical connector has contacts, where some portions of the contacts extend into the housing and some portions of the contacts extend from the housing. A portion of the contacts being in a same plane with the bottom side of the housing.

Surface mountable optoelectronic device

A fiber optic plug for connecting to a receptacle of a small format optoelectronic package or device. The fiber optic plug includes a body and ferrules attached to the body. Each ferrule has an aperture for receiving and holding an optical fiber and each ferrule has a diameter substantially equal to 1.25 mm. The aperture of each adjacent ferrule is separated by a distance of approximately 3.125 mm. The ferrules exist in a plane.

High density multiple fiber optic connector

A device or array of arrayed optical subassemblies includes modular units called one channel sub-assemblies. Each of the one channel sub-assemblies includes a small format optical subassembly attached to a substrate and an optical coupling element all of which is connected to a base. The optical coupling element includes a focusing element and a ferrule receiving bore. The arrayed device makes it possible to remove and replace one of the one channel sub-assemblies with another one channel sub-assembly. The small format optical subassembly of the one channel sub-assembly may be a transmitter or a receiver. Thus, the device is a modular, high-density, multiple optical transmitter/receiver array.

Modular high density multiple optical transmitter/receiver array

The transceiver includes a housing, a transmitting optical sub-assembly mounted in the housing, a receiving optical sub-assembly mounted in the housing, a first electrical connector associated with the transmitting optical sub-assembly, a second electrical connector associated with the receiving optical sub-assembly, and an electro-magnetic shield mounted on the housing. The housing includes a first fiber optic connector receptacle, a second fiber optic connector receptacle, and a first side, and the housing is made of an electrically conductive material.

Surface mountable transceiver

A pluggable optical transceiver module includes two optoelectronic devices mounted to a printed circuit board, and a High Speed Serial Data Connector connected to the printed circuit board. The printed circuit board, and associated optoelectronic devices and the High Speed Serial Data Connector being mounted in a housing. One of the two optoelectronic devices is a transmitter. The other of the two optoelectronic devices is a receiver. The pluggable optical transceiver module converts optical signal to electrical signals, and, also, converts electrical signals to optical signals. The High Speed Serial Data Connector is pluggable into a High Speed Serial Data Connector receptacle of a host device. Another portion of the module may have ports for receiving LC style fiber optic connectors.

Pluggable optical transceiver module having a high speed serial data connector (HSSDC)

A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has two through-holes formed through a thickness of the non-electrically conductive substrate. The two through-holes are filled with an electrically conductive material so as to form two electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into two regions. The first region has the electrically conductive plating material applied thereto. The first and second through-holes protrudes through the second region. The optical diode has a first lead electrically connected to the first via, and the optical diode has a second lead electrically connected to the second via.

A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto. The first through-hole protrudes through the first region. The second and third through-holes protrude through the second region. The first via is electrically connected to the electrically conductive plating material adhered to the first region. The optical diode and the monitor diode both have leads which are mounted on the electrically conductive plating of the first region. A first conductor electrically connects another lead of the optical diode to the second via, and a second conductor electrically connects another lead of the monitor diode to the third via.

Growing community of inventors

Forest Park, IL, United States of America

Carlos Jines