International Business Machines Corporation

Carlos C Periu

Robert Lewis Rohr

Robert D MacInnes

An improved apparatus and method are disclosed for heating objects, such as electronic chips being bonded to substrates, in which a copper heat exchanger element (12) comprises a circuitous interior passage (26) through which gases pass from a source (30) to be heated by a heater (74) to a desired temperature and to be cleansed of unwanted oxygen by catalytic reaction, prior to entering a furnace chamber (22) heated from below by the heat exchanger element (12) and from above by a further heater (72) and copper plate (60), whereby essentially uniform gas temperature, acceptably low oxygen concentration and fast cycling times are provided in the furnace chamber (22). See FIG. 1.

Growing community of inventors

Boca Raton, FL, United States of America

Carlos C Periu