Intel Corporation

Carlos Alvizo Flores

David Shia

Barrett M Faneuf

Kenan Huseyin Arik

Brendan T Pavelek

Minh T D Le

Jeffory L Smalley

Ralph V Miele

Sandeep Ahuja

Phil Geng

Casey R Winkel

Bijoyraj Sahu

Aaron P Anderson

Marc Milobinski

Fernando Gonzalez Lenero

Jun Zhang

Damion T Searls

Richard J Dischler

Thomas A Boyd

Jin Yang

Eric W Buddrius

Craig J Jahne

Eric Dwight McAfee

Prabhakar Subrahmanyam

Christopher Wade Ackerman

Catharina Biber

Minh T Le

Kristin L Weldon

Ying-Feng Pang

Michael Berktold

Yi Xia

Evan A Chenelly

Victor Polyanko

Yuyang Xia

Lianchang Du

Javier Avalos Garcia

Adriana Lopez Iniguez

Eric D Mcafee

Mark Bianco

Yuehong Fan

Luz Karine Sandoval Granados

Samer Melhem

Jeffrey Ryan Conner

John Raatz

Bergen Anderson

Shengzhen Zhang

Yuan Li

Hemant Desai

An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Liquid cooling system leak detection improvements

An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Electronic systems with inverted circuit board with heat sink to chassis attachment

An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.

Modular thermal energy management designs for data center computing

Growing community of inventors

Jalisco, Mexico

Carlos Alvizo Flores