Entegris, Inc.

Axcelis Technologies, Inc.

Other

Lam Research Corporation

Intel Corporation

Dow Corning Corporation

Axcelis Technology, Inc.

Carlo Waldfried

Orlando Escorcia

Qingyuan Han

Ivan L Berry, Iii

Ivan Berry

I-Kuan Lin

Yan Liu

Palani Sakthivel

Chandra Venkatraman

Bryan Clark Hendrix

Richard A Cooke

Jakub Rybczynski

Nilesh Gunda

Ralph Albano

David Walter Peters

Weimin Li

Thomas James Buckley

Chandrasekaran Venkatraman

Yuxuan Liu

Wei Chen

Pushkara Rao Varanasi

Ebrahim Andideh

Eric S Moyer

Atsushi Shiota

Wade Krull

Aseem Kumar Srivastava

Alan C Janos

Montray Leavy

Subhash Guddati

Michael John Spaulding

Rex Gerald Sheppard

Steven Donnell

Troy B Scoggins

Shijian Luo

Thines Kumar Perumal

Alan Frederick Becknell

Richard E Pingree, Jr

Caleb Minsky

David Ferris

Palanikumaran Sakthivel

Zhifeng Li

John Michael Glasko

Wolfram Neff

Christopher Garmer

Scott Sirignano

Keping Han

Jayasri Narayanamoorthy

Stephen Longo

Parul Tyagi

Todd Bridgewater

Jeff Jang

Ian Ball

Gary Dahrooge

Han Qingyuan

Nick Sbrockey

Phil Dembowski

Jeff Bremmer

Cory Bargeron

Ganesh Rajagopalan

Darren L Moore

Jianan Hou

Michael Hanagan

Aseem Srivastava

Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, the electrostatic chuck including a pattern of charge dissipation lines on an insulating layer, the lines having a first conductive layer and a second conductive layer and being arranged to define enclosed fields of the insulating layer between the lines.

Electrostatic chuck with a charge dissipation structure

Described are metal bodies made of magnesium-containing metal and having a magnesium fluoride surface passivation region formed at a surface of the body, as well as methods of forming a magnesium fluoride surface passivation region at a surface of a metal body, and uses for the bodies.

Metal body having magnesium fluoride region formed therefrom

Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, and electrostatic chuck base components prepared by an additive manufacturing technique.

Electrostatic chuck prepared by additive manufacturing, and related methods and structures

Described are substrates that include high aspect ratio surfaces and non-high aspect ratio surfaces, at least two coatings, one coating at high aspect ratio surfaces and a second coating at non-high aspect ratio surfaces, and having fluorinated outer surfaces; methods of preparing these coatings; and substrates, surfaces, equipment, and components of equipment that include the coatings.

Substrate with fluorinated yttrium coatings, and methods of preparing and using the substrates

A conductive polymeric layer on an electrostatic chuck. The conductive polymeric layer comprises a conductive polymer and a photosensitive polymer. The conductivity of the conductive polymer promotes charge dissipation by the conductive polymeric layer, while the photosensitivity of the photosensitive polymer allows the surface of the conductive polymeric layer to be photopatterned. The extent to which the conductive polymeric layer is conductive and photosensitive may be modulated by varying the relative amounts of the conductive polymer and the photosensitive polymer.

Conductive polymeric layers for charge dissipation

Coatings applicable to a variety of substrate articles, structures, materials, and equipment are described. In various applications, the substrate includes metal surface susceptible to formation of oxide, nitride, fluoride, or chloride of such metal thereon, wherein the metal surface is configured to be contacted in use with gas, solid, or liquid that is reactive therewith to form a reaction product that is deleterious to the substrate article, structure, material, or equipment. The metal surface is coated with a protective coating preventing reaction of the coated surface with the reactive gas, and/or otherwise improving the electrical, chemical, thermal, or structural properties of the substrate article or equipment. Various methods of coating the metal surface are described, and for selecting the coating material that is utilized.

Coatings for enhancement of properties and performance of substrate articles and apparatus

Described are yttrium fluoride compositions, including deposited films, e.g., coatings, that contain yttrium fluoride; methods of preparing yttrium fluoride compositions and deposited film coatings that contain yttrium fluoride; as well as substrates that have a deposited film coating that contains yttrium fluoride at a surface and methods and equipment that include the substrates.

Yttrium fluoride films and methods of preparing and using yttrium fluoride films

Coatings applicable to a variety of substrate articles, structures, materials, and equipment are described. In various applications, the substrate includes metal surface susceptible to formation of oxide, nitride, fluoride, or chloride of such metal thereon, wherein the metal surface is configured to be contacted in use with gas, solid, or liquid that is reactive therewith to form a reaction product that deleterious to the substrate article, structure material, or equipment. The metal surface is coated with a protective coating preventing reaction of the coated surface with the reactive gas, and/or otherwise improving the electrical, chemical, thermal, or structural properties of the substrate article or equipment. Various methods of coating the metal surface are described, and for selecting the coating material that is utilized.

Described are techniques for applying a cured polymeric blanket coating onto a surface, specifically for applying a blanket-coated cured polymeric coating onto a surface of a substrate that is useful as an electrostatic chuck for processing semiconductor wafers.

Methods for applying a blanket polymer coating to a substrate

Disclosed herein are surface coatings for plasma components that have the benefit of being robust against chemical and plasma physical attack in aggressive (e.g., fluorine-based) plasma environments. The coatings also provide low plasma surface recombination rates for active oxygen, nitrogen, fluorine, and hydrogen species when compared with other known surface treatments. The coatings can be applied to any plasma system component not requiring etching or plasma cleaning including but not limited to materials like quartz, aluminum, or anodized aluminum. Additionally, the efficiency of the system is increased by applying a non-reactive coating to system components thereby increasing the flow of excited plasma species to the plasma chamber of the system.

Surface coating for chamber components used in plasma systems

Described are multi-layer coatings, substrates (i.e., articles) coated with a multi-layer coating, and methods of preparing a multi-layer coating by atomic layer deposition, wherein the coating includes layers alumina and yttria.

Chemical resistant multi-layer coatings applied by atomic layer deposition

Described are glass-forming molds made of a graphite mold body and a coating formed by atomic layer deposition, with the coating being made of alumina or a combination of alumina and yttria.

Coatings for glass-shaping molds and molds comprising the same

An electrostatic chuck with a generally non-arcuate top surface shaped protrusions that has edge surfaces similar to a portion of a ellipse. The structure of the protrusions leads to the reduction of particulate material generated by interaction between the supported substrate and chuck. Reduced levels of scratching, abrasion, wear and particulate generation are achieved by improved smoothing and flattening of the protrusion surface.

Wafer contact surface protrusion profile with improved particle performance

An electrostatic chuck includes a ceramic structural element, at least one electrode disposed on the ceramic structural element, and a surface dielectric layer disposed over the at least one electrode, the surface layer activated by a voltage in the electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck. The surface dielectric layer comprises: (i) an insulator layer of amorphous alumina, of a thickness of less than about 5 microns, disposed over the at least one electrode; and (ii) a stack of dielectric layers disposed over the insulator layer. The stack of dielectric layers includes: (a) at least one dielectric layer including aluminum oxynitride; and (b) at least one dielectric layer including at least one of silicon oxide and silicon oxynitride.

Electrostatic chuck and method of making same

Growing community of inventors

Falls Church, VA, United States of America

Carlo Waldfried