Stmicroelectronics S.r.l.

Stmicroelectronics Gmbh

Stmicroelectronics International N.v.

Carlo Valzasina

Gabriele Gattere

Alessandro Tocchio

Luca Giuseppe Falorni

Giorgio Allegato

Barbara Simoni

Lorenzo Corso

Francesco Rizzini

Giacomo Langfelder

Francesco Procopio

Matteo Fabio Brunetto

Daniele Prati

Giovanni Campardo

Roberto Carminati

Enri Duqi

Dario Paci

Paolo Angelini

Andrea Donadel

Roberto Pio Baorda

Gert Ingvar Andersson

Marco Garbarino

Alberto Corigliano

Nils Einar Hedenstierna

Danilo Karim Kaddouri

Davide Magnoni

Huantong Zhang

Raffaele Ardito

Francesco Diazzi

Erik Daniel Svensson

Giacomo Gafforelli

Sebastiano Conti

Federico Vercesi

Matteo Perletti

Luca Guerinoni

Silvia Adorno

Ilaria Gelmi

Tiziano Chiarillo

Igor Varisco

Pasquale Franco

Luca Lamagna

Manuel Riani

Patrick Fedeli

Cristiano Rocco Marra

Giorgio Mussi

Jean Marie Darmanin

Zhang Huantong

The present disclosure is directed to a MEMS gyroscope formed by a substrate and a movable mass suspended on the substrate and configured to carry out a movement in a driving direction and in a detection direction perpendicular to each other. The movable mass has a first face and a second face opposite to the first face. The gyroscope also has a first and a second quadrature compensation electrode group, fixed to the substrate and capacitively coupled to the movable mass. The first quadrature compensation electrode group faces the first face of the movable mass, and the second quadrature compensation electrode group faces the second face of the movable mass. The first and the second quadrature compensation electrode groups each have a respective variable facing area on the movable mass as a result of the movement of the movable mass in the driving direction and are configured to exert an electrostatic force on the movable mass during the movement of the movable mass in the driving direction.

MEMS gyroscope having quadrature compensation electrodes and method for compensating a quadrature error

A microelectromechanical sensor device has a detection structure including: a substrate having a first surface; a mobile structure having an inertial mass suspended above the substrate at a first area of the first surface so as to perform at least one inertial movement with respect to the substrate; and a fixed structure having fixed electrodes suspended above the substrate at the first area and defining with the mobile structure a capacitive coupling to form at least one sensing capacitor. The device further includes a single monolithic mechanical-anchorage structure positioned at a second area of the first surface separate from the first area and coupled to the mobile structure, the fixed structure, and the substrate and connection elements that couple the mobile structure and the fixed structure mechanically to the single mechanical-anchorage structure.

Microelectromechanical sensor device with improved stability to stress

A button device includes a MEMS sensor having a MEMS strain detection structure and a deformable substrate configured to undergo deformation under the action of an external force. The MEMS strain detection structure includes a mobile element carried by the deformable substrate via at least a first and a second anchorage, the latter fixed with respect to the deformable substrate and configured to displace and generate a deformation force on the mobile element in the presence of the external force; and stator elements capacitively coupled to the mobile element. The deformation of the mobile element causes a capacitance variation between the mobile element and the stator elements. Furthermore, the MEMS sensor is configured to generate detection signals correlated to the capacitance variation.

Waterproof MEMS button device, input device comprising the MEMS button device and electronic apparatus

A closed-loop microelectromechanical accelerometer includes a substrate of semiconductor material, an out-of-plane sensing mass and feedback electrodes. The out-of-plane sensing mass, of semiconductor material, has a first side facing the supporting body and a second side opposite to the first side. The out-of-plane sensing mass is also connected to the supporting body to oscillate around a non-barycentric fulcrum axis parallel to the first side and to the second side and perpendicular to an out-of-plane sensing axis. The feedback electrodes are capacitively coupled to the sensing mass and are configured to apply opposite electrostatic forces to the sensing mass.

Closed-loop microelectromechanical accelerometer with compensation of spurious vibration modes and process for manufacturing a microelectromechanical accelerometer

A process for manufacturing a MEMS device includes forming a first structural layer of a first thickness on a substrate. First trenches are formed through the first structural layer, and masking regions separated by first openings are formed on the first structural layer. A second structural layer of a second thickness is formed on the first structural layer in direct contact with the first structural layer at the first openings and forms, together with the first structural layer, thick structural regions having a third thickness equal to the sum of the first and the second thicknesses. A plurality of second trenches are formed through the second structural layer, over the masking regions, and third trenches are formed through the first and the second structural layers by removing selective portions of the thick structural regions.

Process for manufacturing a micro-electro-mechanical device, and MEMS device

An ultrasonic MEMS acoustic transducer formed in a body of semiconductor material having first and second surfaces opposite to one another. A first cavity extends in the body and delimits at the bottom a sensitive portion, which extends between the first cavity and the first surface of the body. The sensitive portion houses a second cavity and forms a membrane that extends between the second cavity and the first surface of the body. An elastic supporting structure extends between the sensitive portion and the body and is suspended over the first cavity.

Ultrasonic MEMS acoustic transducer with reduced stress sensitivity and manufacturing process thereof

A multi-axis MEMS gyroscope includes a micromechanical detection structure having a substrate, a driving-mass arrangement, a driven-mass arrangement with a central window, and a sensing-mass arrangement which undergoes sensing movements in the presence of angular velocities about a first horizontal axis and a second horizontal axis. A sensing-electrode arrangement is fixed with respect to the substrate and is set underneath the sensing-mass arrangement. An anchorage assembly is set within the central window for constraining the driven-mass arrangement to the substrate at anchorage elements. The anchorage assembly includes a rigid structure suspended above the substrate that is elastically coupled to the driven mass by elastic connection elements at a central portion, and is coupled to the anchorage elements by elastic decoupling elements at end portions thereof.

Micromechanical detection structure of a MEMS multi-axis gyroscope, with reduced drifts of corresponding electrical parameters

A button device includes a fixed support structure; a movable structure, laterally surrounded by the support structure and configured to deform at least in part under the action of an external force; and a fluid-tight protection cap. The movable structure includes a piston element, deformable elements having piezoelectric transducers arranged thereon, and anchor elements that couple the piston element to the deformable elements. When an external force acts on the piston element, the anchor elements transfer this force to the deformable elements and to the piezoelectric transducers, so as to sense the extent of this force.

Waterproof MEMS button device, package housing the button device, and method of manufacturing the button device

A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.

Micromechanical device with elastic assembly having variable elastic constant

The accelerometric sensor has a suspended region, mobile with respect to a supporting structure, and a sensing assembly coupled to the suspended region and configured to detect a movement of the suspended region with respect to the supporting structure. The suspended region has a geometry variable between at least two configurations associated with respective centroids, different from each other. The suspended region is formed by a first region rotatably anchored to the supporting structure and by a second region coupled to the first region through elastic connection elements configured to allow a relative movement of the second region with respect to the first region. A driving assembly is coupled to the second region so as to control the relative movement of the latter with respect to the first region.

Accelerometric sensor in mems technology having high accuracy and low sensitivity to temperature and ageing

A microelectromechanical gyroscope includes: a substrate; a stator sensing structure fixed to the substrate; a first mass elastically constrained to the substrate and movable with respect to the substrate in a first direction; a second mass elastically constrained to the first mass and movable with respect to the first mass in a second direction; and a third mass elastically constrained to the second mass and to the substrate and capacitively coupled to the stator sensing structure, the third mass being movable with respect to the substrate in the second direction and with respect to the second mass in the first direction.

Microelectromechanical gyroscope for sensing angular rate and method of sensing angular rate

A microelectromechanical device having a mobile structure including mobile arms formed from a composite material and having a fixed structure including fixed arms capacitively coupled to the mobile arms. The composite material includes core regions of insulating material and a silicon coating.

Micro-electro-mechanical device with reduced temperature sensitivity and manufacturing method thereof

A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.

Microelectromechanical device with signal routing through a protective cap

A gyroscope includes a substrate, a first structure, a second structure and a third structure elastically coupled to the substrate and movable along a first axis. The first and second structure are arranged at opposite sides of the third structure with respect to the first axis A driving system is configured to oscillate the first and second structure along the first axis in phase with one another and in phase opposition with the third structure. The first, second and third structure are provided with respective sets of sensing electrodes, configured to be displaced along a second axis perpendicular to the first axis in response to rotations of the substrate about a third axis perpendicular to the first axis and to the second axis.

Microelectromechanical gyroscope with rejection of disturbances and method of sensing an angular rate

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Gessate, Italy

Carlo Valzasina