Stmicroelectronics S.r.l.

Sgs-thomson Microelectronics S.r.l.

Sgs-thomson Microelectronics Limited

Carlo Cognetti

Michael J Hundt

Ubaldo Mastromatteo

Roberto Tiziani

Giuseppe Marchisi

Andrea Giovanni Cigada

Paolo Casati

A process for manufacturing encapsulated optical sensors, including the steps of: forming a plurality of mutually spaced optical sensors in a wafer of semiconductor material; bonding a plate of transparent material to the wafer so as to seal the optical sensors; and dividing the wafer into a plurality of dies, each comprising an optical sensor and a respective portion of the plate.

Process for manufacturing encapsulated optical sensors, and an encapsulated optical sensor manufactured using this process

A leadframe for semiconductor devices, including a region which is adapted to support a semiconductor device and a plurality of leads which are arranged so as to be directed toward the region, for mutual connection, by connecting wires connecting the leads and the semiconductor device. The leads include leads having at least two different lengths for the connection of connecting wires having different diameters.

Leadframe for integrated circuit chips having low resistance connections

The invention includes a multichip integrated circuit package having at least two chips electrically isolated from one another. Within the multichip integrated circuit package is a slug that is directly coupled to at least two chips, without any intervening insulating layers. The slug is physically separated at an appropriate place between the two chips, so that electrical interference between the two chips is effectively eliminated. Making the integrated circuit package begins with directly attaching the two chips to a heat dissipating slug. The heat dissipating slug can have a pre-cut groove running between the chips. Once the chips are attached to the slug, the slug is molded into the multichip integrated circuit package. Then, the slug is physically separated into two pieces from the underside, the separation running along the pre-cut groove. Usually the slug would be separated by being cut by a saw.

Insulated power multichip package

A control interface device for an electric motor, particularly an electric motor for operating servomechanisms on a vehicle, which includes a conductor frame, an active integrated component mounted on the conductor frame, and a plurality of electric connectors. A single insulating, one-piece enclosing body contains the conductor frame with the active integrated component and the electric connectors included to the conductor frame. Thus, all of the elements required for powering and controlling the motor are gathered inside a single enclosing body which is convenient to handle and connect.

Control interface device for an electric motor

A dam is provided on a surface of a circuit board to which an integrated circuit device is to be mounted. The dam defines a region between the integrated circuit package and the circuit board, and a material is injected into this region after the device has been mounted on the circuit board. This material preferably is a good thermal conductor, assisting in the removal of heat from the device. The injected material also preferably acts as an adhesive, more firmly bonding the device the circuit board.

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Milan, Italy

Carlo Cognetti