Sgs-thomson Microelectronics S.r.l.

Nippon Densan Corporation

Sgs-ates Compnenti Elettronici S.p.a.

Carlo C De Martiis

Giuseppe Marchisi

Paolo Casati

Isao Kaneda

Sandro Cerato

Kohei Yonemura

A die-stamped frame is fastened to a heat sink metal baseplate by wedging flexible tabs into receiving indentations of the baseplate while keeping the frame substantially in contact with the surface of the baseplate. The wire welding operations may then take place on the end of the fingers of the patterned metal frame while the same are solidly resting on the surface of the baseplate thus facilitating the welding. The backing-off of the metal frame from the surface of the heat sink baseplate takes place upon the closing of the mold used for encapsulating in resin the device. The injection of the resin and its solidification 'freezes' the pins in the backed-off position imposed by the mold upon closing, thus ensuring the electrical isolation between the pins and the integral heat sink baseplate.

Apparatus for assembling and resin-encapsulating a heat sink-mounted

A DC motor having a housing, a hub member rotatably supported by the housing, a flexible printed circuit board fixedly mounted on the housing, and an IC chip mounted on the flexible printed circuit board and located facing a recess formed in the housing. The hub member has a shaft rotatably supported by a bearing within the recess. The flexible printed circuit board has a metal layer for mounting the IC chip, the metal layer being isolated from a wiring pattern formed on the printed circuit board. The wiring pattern on the flexible printed circuit board is directly connected to a connection pin connected to the motor wiring.

IC controlled DC motor

Process and apparatus for assembling and resin-encapsulating a heat

An insulating package premolded on a metallic frame with electrical contacts contains in an inner space a semiconductor chip which rests on a thermic dissipator and is connected to the electrical contacts. The inner space of the package is closed on top by a cover provided with a lateral extension with a bent end, which operates not only as a cover, but also as a means for fastening and thrusting the package toward a support surface.

Single-in-line integrated electronic component

Growing community of inventors

Milan, Italy

Carlo C De Martiis