Rockwell Collins, Inc.

Carlen R Welty

Nathaniel P Wyckoff

Richard Korneisel

Jacob R Mauermann

Robert J Frank

Carlos J Chavez

Brandon C Hamilton

Steven E Koenck

Reginald D Bean

James A Marek

Scott J Zogg

Allen P Mass

Brian R Roggendorf

Bret W Simon

Julianne R Crosmer

Michael R Vagher

Bruce S Kloster

Carl J Henning

Jobe D Price

John C Herder

Jonathon C Skarphol

Gregory S Droba

A redundant processing system with profile-based monitoring is disclosed. In embodiments, the redundant system includes two or more redundant lanes, each lane having equivalent processing components. In a testing state, template processors and hardware monitoring sensors are connected to a selected trusted lane and input vectors submitted thereto; the hardware sensors characterize the response of the selected lane and the resulting testing data compiled into system templates. In an operational environment, the template processors send challenges based on the input vectors to each of the redundant lanes in real time, collecting response data from each lane via identical sets of monitoring sensors. The template processors correlate the response data with the corresponding system templates, identifying anomalous lanes and system anomalies based on discorrelations between the response data and the system templates.

Profile-based monitoring for dual redundant systems

A system and method includes pre-warping a mask to induce strain when affixed to a substrate and ensure positive contact between the mask and the substrate during all phases of deposition. A film is applied to the mask at a rate sufficient to impart stress to the film faster than such stress can be released. Depending on the features defined by the mask, the pre-warping may be concentric, linear along one axis, or complex along a plurality of axes.

Controlled warping of shadow mask tooling for improved reliability and miniturization via thin film deposition

An integrated circuit (IC) package incorporating controlled induced warping is disclosed. The IC package includes an electronic substrate having an active side upon which semiconducting dies and functional circuits have been lithographed or otherwise fabricated, leading to an inherent warping in the direction of the active side. One or more corrective layers may be deposited to the opposing, or inactive, side of the semiconducting die via thin film deposition (TFD) instrumentation and techniques in order to induce corrective warping of the electronic substrate back toward the horizontal (e.g., in the direction of the inactive side) to a desired degree.

Controlled induced warping of electronic substrates

An integrated circuit (IC) package incorporating controlled induced warping is disclosed. The IC package includes an electronic substrate having an active side upon which semiconducting dies and functional circuits have been lithographed or otherwise fabricated, leading to an inherent warping in the direction of the active side. One or more corrective layers may be deposited to the opposing, or inactive, side of the semiconducting die via electroplating in order to induce corrective warping of the electronic substrate back toward the horizontal (e.g., in the direction of the inactive side) to a desired degree.

Controlled induced warping of electronic substrates via electroplating

A system and a method. The system may include a node of a network of nodes, wherein the network is configured as a modified time division multiple access (TDMA) network. The node may include a processor and a transceiver communicatively coupled to the processor. The processor may be configured to: collect data received from each other node of the network during a data collection phase of a given modified TDMA cycle, the collected data including information of connectivity between pairs of nodes of the network; and output the collected data for transmission to each other node of the network during a data distribution phase of the given modified TDMA cycle.

Modified time division multiple access (TDMA) network

A system providing a scalable distributed operating environment is provided. The system may include a cryptographic module for encrypting communications for transmission over an external network. Further, more than one classified processor may be communicatively coupled to the cryptographic module for handling classified processes and information. In addition, more than one unclassified processor may also be communicatively coupled to the cryptographic module for handling unclassified processes and information. The number of classified and unclassified processors activated upon selection of a waveform is dependent upon the degree of complexity of the waveform.

Scalable distributed software defined radio (SDR) and mission computing architecture

The present invention is directed to a small size and light weight small form factor user system suitable for having TTNT connectivity which consumes minimum power to operate. The small form factor user system having TTNT connectivity may be capable of interacting in a low latency real time manner with airborne networks. The small form factor user system having TTNT connectivity may have significantly reduced radio power consumption and form factor size through maintaining core capabilities of the full size TTNT terminal while relaxing other capabilities. An encapsulated message structure may be utilized to simplify communication between the TTNT small form factor user system and the full size TTNT nodes.

Tactical targeting network technology small form factor user system

A system for simultaneously transmitting and receiving signals in a frequency hopping system. The system includes a multiplexor configured to filter a plurality of frequency hopping message pulses based on a frequency associated with each pulse, a plurality of transceivers configured to receive the pulses from the multiplexor, and a modem configured for simultaneous transmission and reception whereby transmission of the pulses are isolated from potentially received pulses by selecting a specific sub-band and transceiver corresponding to the specific sub-band through which to transmit each pulse.

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Solon, IA, United States of America

Carlen R Welty