Covidien LP

Corning Incorporated

Lsi Logic Corporation

Kla Tencor Corporation

Advanced Energy Industries, Inc.

Carl William Almgren

Hendrik Walde

Leonard Joseph Mahoney

Gregory A Roche

William W Saylor

William D Sproul

Joe Don Sartor

Kenneth Edward Hrdina

Daniel Robert Boughton

Christopher Scott Thomas

Stefan Wolfgang Kramel

A system, having: an RF power source; an RF matching network electrically coupled to the RF power source; an impedance matching circuit electrically coupled to the RF matching network, wherein the impedance matching circuit has a first adjustable capacitor connected in series with the RF matching network and a second adjustable capacitor connected in parallel with the first capacitor; and an inductive process load electrically coupled to the impedance matching circuit.

Systems and methods for optimizing RF plasma power coupling

A system and method for convectively heating tissue to smooth the surface of the tissue. A fluid, such as saline is distributed across a tissue surface. A bipolar tool is placed within the fluid, but not touching the tissue. An RF signal is sent from a generator through the electrodes to rapidly boil the fluid. Heat is then transferred from the boiling fluid to the tissue resulting in minimal heat damage to tissue. An impedance matching system is used to maximize power received at the bipolar from the generator. Additionally, a control system monitors the boiling fluid to limit arcing.

Bipolar chondroplasty device

A plasma processing system is provided with diagnostic apparatus for making in-situ measurements of plasma properties. The diagnostic apparatus generally comprises a non-invasive sensor array disposed within a plasma processing chamber, an electrical circuit for stimulating the sensors, and means for recording and communicating sensor measurements for monitoring or control of the plasma process. In one form, the sensors are dynamically pulsed dual floating Langmuir probes that measure incident charged particle currents and electron temperatures in proximity to the plasma boundary or boundaries within the processing system. The plasma measurements may be used to monitor the condition of the processing plasma or furnished to a process system controller for use in controlling the plasma process.

Sensor array for measuring plasma characteristics in plasma processing environments

An electrode assembly for a plasma reactor used in connection with fabrication or manufacture of semiconductor devices. The electrode assembly includes an anode having, a top side that includes a pedestal adapted to support a wafer and defines an annular void that preferably surrounds the pedestal and extends to an outer periphery of the top side. The electrode assembly also includes a ring removably received within the annular void so that the ring extends from the pedestal and covers substantially the entire portion of the top side of the anode save the pedestal. The thickness of the ring is slightly less than the height of the pedestal so that the top surface of the ring is located below the top surface of the pedestal. When the wafer is supported by the pedestal during fabrication of a semiconductor device, the wafer extends beyond the circumference of the pedestal, and a gap is defined between the wafer and the removable ring. The removable ring can be quickly and easily removed and replaced.

Electrode assembly for plasma reactor

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Fort Collins, CO, United States of America

Carl William Almgren