Inphi Corporation

Broadcom Corporation

Hrl Laboratories, LLC

The Boeing Company

Carl W Pobanz

Lawrence M Burns

Ramon Alejandro Gomez

Gopal Raghavan

Sung-Hsien Chang

Mehran Matloubian

Peter David Brewer

Liang Zhang

Michael G Case

James Hoffman

Leonardo Vera

Friedel Gerfers

Myoung Joon Choi

Vivek Gurumoorthy

Chienhsin Lee

Andrew J Burstein

Andrew T Hunter

John A Roth

Steffen O Nielsen

Ariel Leonardo Vera Villarroel

Subramaniam Shankar

Jeffrey C Yen

Dhruv Jain

Nikhil K Srivastava

Zabih Toosky

Lawrenece M Burns

Paul Murtagh

An optical modulator device using three-terminal driver interface. The modulator device can include a driver circuit, three transmission lines, a pair of diodes, and a diode termination resistor. This device can have the diode termination resistor coupled to the first and third transmission lines. The three transmission lines can be coupled to the two diodes. The first diode can be coupled to the first and second transmission line and the second diode can be coupled to the second and third transmission lines. The second transmission line presents a relatively low impedance to the asymmetric current that reduces the current to levels that do not degrade the optical waveforms at either diode. The impedance appears in parallel with the high-frequency low-impedance synthesized by the differential drive interacting with the symmetric components of the diode load. This configuration results in a fast, well-controlled transient response.

Method and system of a three-terminal driver for modulator devices

The present invention is directed to electrical circuits. More specifically, an embodiment of the present invention provides a differential amplifier in cascode configuration. An input transistor is coupled to an output transistor via a peaking inductor. The output transistor is also directly coupled to a degeneration resistor. There are other embodiments as well.

Differential amplifier with extended bandwidth and THD reduction

A driver circuit device using driver equalization in power and ground terminated transmission line channels. The driver circuit device can include a weaker pull-up driver, which is needed to pre-emphasize the pull-up signal for driver equalization in power terminated transmission line channels. The driver circuit device can also include a weaker pull-down driver, which is needed to pre-emphasize the pull-down signal for driver equalization in ground terminated transmission line channels. In the transmission line channels with power terminations, a weaker pull-up Ron is implemented. In the transmission line channels with ground terminations, a weaker pull-down Ron is implemented. Drivers implemented in power and/or ground terminated transmission line channels can be used to improve device performance, such as in signal eye opening.

Method and system using driver equalization in transmission line channels with power or ground terminations

The present disclosure provides a detailed description of techniques for implementing a linear amplifier with extended linear output range. More specifically, the present disclosure discloses techniques for extending the output signal range of a linear amplifier with a minimum increase in power consumption and die area consumption. Some embodiments facilitate coupling boost amplifiers with adjustable independent biasing to a main amplifier to boost the output signal near the non-linear regions of the transfer curve to extend the linear range. Certain embodiments comprise a first boost amplifier biased to contribute to the output signal when the input signal is near a negative threshold voltage, and a second boost amplifier biased to contribute to the output signal when the input signal is near a positive threshold voltage. In certain embodiments, the threshold voltages and/or the bias currents can be controlled to adjust certain amplifier attributes.

Linear amplifier with extended linear output range

An optical modulator device directly-coupled to a driver circuit device. The optical modulator device can include a transmission line electrically coupled to an internal VDD, a first electrode electrically coupled to the transmission line, a second electrode electrically coupled to the first electrode and the transmission line. A wave guide can be operably coupled to the first and second electrodes, and a driver circuit device can be directly coupled to the transmission line and the first and second electrodes. This optical modulator and the driver circuit device can be configured without back termination.

Direct coupled driver for mach-zehnder optical modulators

Direct-coupled driver for Mach-Zehnder optical modulators

Direct-coupled driver for mach-zehnder optical modulators

A clock driver integrated circuit device and method is provided. The device can include a VTT regulator provided on a single integrated circuit (IC) chip. A first termination at an internal VDD/2 can be coupled to the VTT regulator. A VTT bus can be coupled to the first termination. A plurality of command control inputs can be coupled to the VTT bus. The plurality of command inputs can include A, BA, RAS, CAS, WE, CS, CKE, ODT, PARIN, and the like. A VDD termination can be coupled to a first end of the VTT bus and a ground can be coupled to a second end of the VTT bus. The method can include regulating or removing signal noise from a host controller via the clock driver IC device.

High speed digital signal termination circuit

A bandpass filter includes a plurality of resonators. An input pin is connected to a first resonator of the plurality of resonators. An output pin is connected to a second resonator of the plurality of resonators. The first and second resonators are magnetically coupled to each other. The first and second resonators are coupled to other resonators using mixed coupling. The other resonators are coupled to each other using electric coupling.

Compact bandpass filter for double conversion tuner

A master-slave flip-flop comprises master and slave latches, with the data output of the master latch connected to the data input of the slave latch. The latches receive clock signals CKM and CKS at their respective clock inputs; each latch is transparent when its clock signal is in a first state and latches a signal applied to its input when its clock signal is in a second state. A clock buffer receives an input clock CKand generates nominally complementary clock signals CKM and CKS such that one latch is latched while the other is transparent. The clock buffer is arranged to skew CKS with respect to CKM such that the slave latch is made transparent earlier than it would without the skew, making the minimum delay (t) between the toggling of CKand a resulting change at the slave latch's output less than it would otherwise be.

Master-slave flip-flop and clocking scheme

A bandpass filter includes a plurality of resonators on a printed circuit board. An input pin is connected to a first resonator of the plurality of resonators. An output pin is connected to a second resonator of the plurality of resonators. The first and second resonators are magnetically coupled to each other. The first and second resonators are coupled to other resonators using mixed coupling. The other resonators are coupled to each other using electric coupling.

A method for fabricating high performance vertical and horizontal electrical connections in a three dimensional semiconductor structure. A dielectric film is imprinted with a stamp pattern at high vacuum and with precise temperature and stamping pressure control. The stamp pattern may be formed on a substrate using semiconductor fabrication techniques. After the dielectric film is stamped, residual dielectric film is removed to allow access to an underlying layer. Via and trench regions formed within the dielectric film by stamping are then metalized to provide the high performance interconnections. Multiple layers of interconnections in the three dimensional structure are provided by stacking layers of stamped and metalized dielectric films on top of each other.

Process for producing high performance interconnects

A method for assembling an electronic system with a plurality of layers. Recesses in formed in one or more dielectric layers and electronic components are positioned within the recesses. One or more layers containing the components are placed on a host substrate containing host circuits. Electrical interconnects are provided between and among the electronic components in the dielectric layers and the host circuits. The layers containing the components may also be provided by growing the electronic devices on a growth substrate. The growth substrate is then removed after the layer is attached to the host substrate.

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Topanga, CA, United States of America

Carl W Pobanz