Tektronix, Inc.

Westinghouse Electric Corporation

Planar Systems, Inc.

Carl W Laakso

William A Barrow

John J Reagan

Eric R Dickey

Juris A Asars

Zoltan K Kun

David Leksell

Keith E Jones

John Albert Wright

H Erwin Grellmann

Leonard A Roland

Robert Lee Beckman

H Erwin Grellman

A full color TFEL display includes stacked panels emitting blue and a combination of red and green light. The panel nearest the viewer employs transparent electrodes on both sides and an insulator bridge structure for the scanning electrodes that alleviates the effect of pinhole defects. The panel farthest from the viewer employs transparent-top electrodes. Each row electrode on the scanning side includes an insulator bridge extending across the panel and then ITO pads extending laterally of the bridge onto the EL stack to form sub pixel points. A bus bar connects all the pixel pads in a row and provides the scanning voltage. The insulator bridge prevents the bus bars from shorting out and permits the pixel pads to fuse open in the event of a short circuit.

Dual substrate full color TFEL panel with insulator bridge structure

A TFEl structure has a multi-layer construction which includes a bottom substrate layer, a lower electrode layer, a middle EL stack, and an upper electrode layer. Forward portions of the EL stack and the lower and upper electrode layers have formed therethrough a series of longitudinal channels and a transverse street connecting the channels and extending along a forward edge of the bottom substrate layer so as to define a plurality of pixels having light-emitting front edges setback from the forward edge of the bottom substrate layer by the width of the street. Rearward portions of the lower and upper electrode layers respectively underlie and overlie a rearward portion of the EL stack but not each other so as to electrically isolate the rearward portions of the lower and upper electrode layers from one another. Also, a bus bar layer overlies the rearward portion of the EL stack and crosses the rearward portion of the upper electrode layer. An insulation layer is interposed between the rearward portions of the bus bar layer and upper electrode layer. Selected portions of the bus bar layer and upper electrode layer are electrically connected together through the insulation layer.

Multi-layer structure and method of constructing the same for providing

A microwave interconnect for integrated or hybrid circuits includes a flexible sheet bearing a flexible conductor which is divided into a plurality of insulated conductive lines, at least some of which make contact with the integrated or hybrid circuit, as well as with a second circuit to which the first is thereby connected. The flexible sheet is backed by a body of elastomeric material and a compression bar which assures good electrical contact of the flexible conductor with the circuits when the compression bar is tightened down on the circuits. The construction allows some degree of misregistration of parts while providing circuit coupling operative at high frequencies.

Microwave interconnect

A polyimide embedded conductor process assures adherence of a metal conductor to a polyimide layer and allows closer spacing between conductors. The conductor is laid on a sacrificial substrate, and then the polyimide layer is laid over the conductor and substrate. The substrate is etched away to expose the conductor, and the polyimide layer may be etched away from the conductor to form attachment tabs.

Polyimide embedded conductor process

An electrical connection between two semiconductor devices employs a coplanar microstrap waveguide comprising a plurality of thin straps of conductive metal embedded in a polyimide substrate and dimensioned to exhibit the properties of a coplanar waveguide. The waveguide structure provides the proper impedance matching between the two devices and enables them to handle signals having frequencies in the gigahertz range.

Coplanar microstrap waveguide interconnector and method of

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Portland, OR, United States of America

Carl W Laakso