General Electric Company

Carl Stephen Lester

Bin Wei

Thomas James Batzinger

Robert John Filkins

Curtis Wayne Rose

Shridhar Champaknath Nath

Kenneth Gordon Herd

Yuri Alexeyevich Plotnikov

Edward James Nieters

Michael Scott Lamphere

Michael Joseph Mahony

Venkata Vijayaraghava Nalladega

Sandeep Kumar Dewangan

Peter S Allison

Andrew A May

Li Wei

Thomas Walter Rogenski

Michael Mahony

An inspection system includes one or more processors and an infrared (IR) camera operably coupled to the one or more processors. The one or more processors control a microwave transmitter to sequentially emit microwaves having different frequencies within a designated frequency range into an object during a first sweep. The IR camera generates thermal image data of the object after the object is heated by each of the different frequencies of microwaves. The one or more processors analyze the thermal image data and determine a selected frequency within the designated frequency range that provides greater heating of the object than one or more other frequencies in the designated frequency range. The one or more processors also analyze select thermal image data of the object, responsive to heating of the object by the selected frequency of microwaves, to detect an element in the object.

Inspection system and method

A wireless transceiver for performing ultrasonic measurements includes an uplink transmitter configured to transmit at least one modulated timing pulse signal. Each modulated timing pulse signal is transmitted over a respective uplink wireless channel. The transceiver further includes at least one uplink receiver, which is adapted to receive a respective one of the modulated timing pulse signals from the uplink transmitter and configured to supply an unmodulated timing pulse signal to a respective transducer. The transceiver further includes at least one downlink transmitter, which is adapted to receive an echo signal from the respective transducer, and is configured to extract envelope information from the echo signal and to transmit a modulated echo signal over a respective downlink wireless channel. The transceiver also includes a downlink receiver adapted to receive the modulated echo signals from the respective downlink transmitters.

Wireless transceiver and method for remote ultrasonic measurements

A method for remotely monitoring at least one sensor and a measurement system. The method includes making a first measurement using a first sensor of the at least one sensor. The method also includes converting the first measurement into a first data signal; and transmitting the first data signal via a wireless connection to a first processor. The measurement system includes at least one sensor unit having at least one sensor for making a first measurement; and a first wireless transceiver coupled to the at least one sensor for transmitting a data signal based on the first measurement. The measurement system includes a second wireless transceiver arranged for receiving the data signal from the first wireless transceiver, and a first processor coupled to the second wireless transceiver arranged for receiving the data signal from the second wireless transceiver.

Method and apparatus for internet enabled, wireless remote sensor measurement

A system and method for monitoring defects in a structure are provided. The system includes a power supply for supplying an electric current to a monitoring area of the structure and a reference; a measurement circuit for measuring a potential drop across at least two contact points of the monitoring area and at least two contact points of the reference; and a processor adapted to determine a ratio of the monitoring area potential drop to the reference potential drop indicative of a percentage change in a thickness of the structure. The method includes the steps of supplying the current to the monitoring area and the reference; measuring a first potential drop across the monitoring area and the reference; and determining the ratio indicative of the percentage change in the thickness of the structure.

System and method for monitoring defects in structures

A pulsed eddy current sensor probe includes a sensor array board. A number of sensors are arranged on the sensor array board and are operable to sense and generate output signals from the transient electromagnetic flux in a part being inspected. Each of the sensors has a differential output with a positive and a negative output. At least one drive coil is disposed adjacent to the sensors and is operable to transmit transient electromagnetic flux into the part. A first and a second multiplexer are arranged on the sensor array board and are operable to switch between the sensors. The first and second multiplexers are connected to the positive and negative outputs of the sensors, respectively.

Pulsed eddy current sensor probes and inspection methods

A self referencing eddy current probe for determining conductive coating thickness includes a housing having a reference sample area, for accommodating a reference sample, and a testing edge, for positioning on a component during a coating thickness measurement. The eddy current probe further includes a reference eddy current coil situated in the housing adjacent to the reference sample area and a test eddy current coil, which is located at the testing edge. A self referencing eddy current measurement system, for measuring a thickness of a conductive coating on a component, includes the self referencing eddy current probe. The system further includes a signal generator for energizing the test and reference coils and a comparison module for comparing a test signal received from the test coil and a reference signal received from the reference coil and outputting a compared signal.

Self reference eddy current probe, measurement system, and measurement method

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Porter Corners, NY, United States of America

Carl Stephen Lester