E.i. Dupont De Nemours and Company

Carl Robert Haeger

Christopher Dennis Simone

Brian C Auman

G Sidney Cox

Richard A Wessel

Sidney G Cox

The present disclosure is directed to a circuit board having a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply derived from 100 mole % 3,3',4,4&#x2032;-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2&#x2032;-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4&#x2032;-oxydianiline, a third imaged metal layer, a second electrically insulating layer and a forth imaged metal layer. The circuit board does not have an adhesive layer between the second imaged metal layer and the polyimide bondply or the third imaged layer and the polyimide bondply.

Circuit board

The present disclosure is directed to a circuit board having a first polyimide coverlay, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply, a third imaged metal layer, a second electrically insulating layer, a forth imaged metal layer and a second polyimide coverlay. The first polyimide coverlay, the polyimide bondply and the second polyimide coverlay are derived from 100 mole % 3,3',4,4&#x2032;-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2&#x2032;-bis(trifluoromethyl) benzidine, and 10 to 80 mole % 4,4&#x2032;-oxydianiline.

A back-sheet for a photovoltaic module is provided comprising a fire resistant polymeric film and a second polymeric film adhered to the fire resistant polymeric film. The fire resistant polymeric film comprises a polymer that does not melt at temperatures below 275&#xb0; C. and an inorganic particulate filler selected from inorganic metal oxides and inorganic metal nitrides, and combinations thereof. The fire resistant polymeric film contains from 40 to 75 weight percent inorganic particulate filler based on the total weight of the film, and the fire resistant polymeric film has an average thickness of at least 85 microns. A photovoltaic module comprising such a back-sheet is also provided.

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Reynoldsburg, OH, United States of America

Carl Robert Haeger