Applied Materials, Inc.

Carl R Johnson

Keith A Miller

Kirankumar Neelasandra Savandaiah

Martin Lee Riker

Adolph Miller Allen

William R Johanson

Zhong Qiang Hua

Viachslav Babayan

Michael Rosenstein

Allen K Lau

Jingjing Liu

Shreekant Gayaka

Vanessa Faune

Jeffrey Ludwig

Winsor Lam

Vaibhav Soni

Sharon Niehoff

Sundarapandian Ramalinga Vijayalaks Reddy

Les Wojnowski

Lawrence A Ringor

Ye Xu

Apparatus and methods for reducing and eliminating accumulation of excessive charged particles from substrate processing systems are provided herein. In some embodiments a process kit for a substrate process chamber includes: a cover ring having a body and a lip extending radially inward from the body, wherein the body has a bottom, a first wall, and a second wall, and wherein a first channel is formed between the second wall and the lip; a grounded shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first channel of the cover ring; and a bias power receiver coupled to the body and extending through an opening in the grounded shield.

Biased cover ring for a substrate processing system

A method, apparatus and system for controlling the processing of a substrate within a process chamber are described herein. In some embodiments, a method of controlling a substrate process within a process chamber includes determining a position of a moveable magnetron in the process chamber relative to a reference location on a surface of the substrate and modulating a power parameter of at least one power supply affecting substrate processing based on the determined position of the magnetron to control, for example, at least one of a deposition rate or an etching rate of the substrate processing. In one embodiment, the modulated power parameter is a power set point of at least one of a direct current (DC) source power, a radio frequency (RF) bias power, a DC shield bias voltage, or an electromagnetic coil current of the at least one power supply.

Physical vapor deposition (PVD) plasma energy control per dynamic magnetron control

Embodiments of a capacitor assembly for coupling radio frequency (RF) and direct current (DC) power to an electrode and substrate support incorporating same are provided herein. In some embodiments, the capacitor assembly includes a first conductive plate to receive RF power from an RF power source, the first conductive plate including a central bore; at least one capacitor coupled to the first conductive plate and surrounding the central bore; and a second conductive plate electrically coupled to the first conductive plate via the at least one capacitor, the second conductive plate including an input tap to receive DC power from a DC power source and at least one output tap to couple the RF and DC power to an electrode.

Capacitor assemblies for coupling radio frequency (RF) and direct current (DC) energy to one or more common electrodes

An apparatus for a lock out/tag out device that is a permanent attachment to a standard breaker box is disclosed. The device is designed to prevent movement of an electrical breaker handle to a closed position when the device is in use. The device also prevents locking a breaker in an on position, thereby lowering safety concerns. When the device is not in use, the device will not interfere with the operation of the breakers and stays conveniently attached to the breaker box. The device also allows storage of locking devices when not in use, thereby enabling personnel to perform a service procedure more efficiently.

Build-in LOTO device on equipment breaker panel

Growing community of inventors

Tracy, CA, United States of America

Carl R Johnson