Bio-rad Laboratories, Inc.

Carl Marlowe

Evan Thrush

Amir Sadri

Michael Griffin

Stephen Swihart

Kenneth Oh

Brian David Wilson

Nenad M Kircanski

Thanh-Vi Tran

Nenad Kircanski

Thanh Vi Tran

Methods and reference compositions for quantifying protein using tagged standards. In an exemplary method, a reference composition and a protein may be electrophoresed in respective lanes of a gel. The reference composition may include quantitation standards of different size and each including a tag present at a different concentration. The quantitation standards and the protein may be transferred from the gel to a solid support to create a blot. Luminescence may be detected from the blot to obtain respective luminescence values separately representing an abundance of the tag of each quantitation standard and an abundance of the protein. A quantity of the protein may be determined using the respective luminescence values.

Method and composition for quantifying protein using tagged standards

Systems and methods for contact imaging of stands with illumination are disclosed herein. A contact imaging system can include a contact imager. The contact imager can include a housing having a base and a lid. The lid can have a closed position against the base and an open position. The contact imager can include a contact area image sensor. The lid can shield the contact area image sensor from ambient light when the lid is in the closed position. The contact imager can include an illuminator that can illuminate at least a portion of a blot on the contact area image sensor when the lid is in the closed position.

Contact imaging of standards with illumination

A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.

Heat pump device and assembly

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San Francisco, CA, United States of America

Carl Marlowe