Motorola Corporation

Carl M Thielk

Branko L Avanic

Anthony J Suppelsa

Richard J Kolcz

A substrate,has an electrically adjustable trim pad,on the bottom side. A circuit pattern,resides on the top side, covered by an RF shield,. The trim pad is located on the bottom side directly below the RF shield, and is electrically connected,to the circuit pattern. A number of surface mount connections,, typically C5 solder bumps, are located on the bottom side, and surround the trim pad. The trim pad is trimmed after the RF shield is attached, thus providing more accurate tuning of the circuit on the top side.

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Boca Raton, FL, United States of America

Carl M Thielk