Analog Devices,inc.

Other

Anaglog Devices, Inc.

Carl M Roberts

John R Martin

Lawrence E Felton

Kieran P Harney

John R Saxelby, Jr

Roger M Moseson

Lewis H Long

Kieran P Harncy

Paul A Ruggerio

A die has a part that is sealed with a cap. The seal can be hermetic or non-hermetic. If hermetic, a layer of glass or metal is formed in the surface of the die, and the cap has a layer of glass or metal at a peripheral area so that, when heated, the layers form a hermetic seal. A non-hermetic seal can be formed by bonding a cap with a patterned adhesive. The cap, which can be silicon or can be a metal paddle, is electrically coupled to a fixed voltage to shield the part of the die.

Methods for packaging and sealing an integrated circuit die

Package for sealing an integrated circuit die

A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.

Wafer level capped sensor

Apparatus and methods for adding side or prop wagers to betting games, particularly the games of Blackjack and Poker. A Blackjack table is disclosed which comprises betting spots each of which comprises indicia describing a side or prop bet combination and odds offered for a wager against the combination. A video Blackjack machine is disclosed which is played with and without side or prop bets. A special Blackjack side or prop bet entry keyboard is disclosed. A video Poker machine is disclosed which is also played with and without prop bets. A special Poker side or prop bet entry keyboard is disclosed. The Poker keyboard is a subset of the Blackjack keyboard permitting Poker to be played with and without side or prop bets on the video Blackjack machine.

Methods for prop bets for blackjack and other games

A method for separating individual dies from a wafer in which the wafer is adhered to a plastic film on a film carrier with the circuit side of the wafer facing the film and with circuit components exposed through a hole in the film. In this manner, the circuitry is protected from dust, and trauma from the sawing and cleaning processes because the circuitry is sealed between the film and the non-circuit side of the wafer.

Method for separating circuit dies from a wafer

Wire-bonded IC chips are coated with siloxane polyimide and cured to a hardened state. The coating is applied over portions of the circuitry which are stress-sensitive. The coating is spaced away from the wire-bond regions of the chip. Thereafter, the coated chip is plastic encapsulated in conventional fashion.

Producing integrated circuit chips with reduced stress effects

Non-uniform compressional, thermal dissipation and thermal expansion stresses in packaged chip devices are eliminated or substantially reduced by providing an aluminum attachment layer on the back side of wafers from which the chips themselves, to be mounted in the packaged chip devices, are produced. The aluminum-backed chips produced from such aluminum-backed wafers can be attached to cavities or tabs of packages such that essentially 100% attachment or bonding contact of the chip back side to the package is obtained when the chip is attached thereto with a gold eutectic preform material.

Growing community of inventors

Topsfield, MA, United States of America

Carl M Roberts