Hewlett-packard Company

Hewlett-packard Development Company, L.p.

Carl Lan Wu

Naoto A Kawamura

Qin Liu

Richard W Seaver

Colin C Davis

Jeffery S Hess

Donald E Wenzel

Colby Van Vooren

Chien-Hau Chen

Chien-Hua Chen

Erik D Torniainen

Mark Sanders Taylor

A fluid delivery system includes a plurality of nozzles having an outer surface and a bore. A hydrophobic layer is applied to a portion of the outer surface of the nozzle and extends into the nozzle bore a determined distance.

Hydrophobic nozzle exit with improved micro fluid ejection dynamics

A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.

Direct imaging polymer fluid jet orifice

Growing community of inventors

Corvallis, OR, United States of America

Carl Lan Wu