Lexmark International, Inc.

Funai Electric Company Ltd.

Carl Edmond Sullivan

Frank Edward Anderson

James M Mrvos

Ashok Murthy

Yimin Guan

Timothy Lowell Strunk

Paul Timothy Spivey

Andrew McNees

Jeanne Marie Saldanha Singh

Steven Robert Komplin

James Harold Powers

Gary Raymond Williams

Burton Lee Joyner, Ii

Richard Earl Corley, Jr

Gary Allen Denton

George Keith Parish

Stuart M Jacobsen

Kristi Maggard Rowe

David L Bernard

David Amos Ward

Paul William Dryer

Kent Lee Ubellacker

Michael David Lattuca

Zachary Justin Reitmeier

Sean Terrence Weaver

Burton Joyner, Ii

Darrin Wayne Oliver

John Glenn Edelen

Robert Wilson Cornell

Roger Steven Cannon

Benjamin Alan Askren

David Emerson Greer

Jeffery James Buchanan

Brant Dennis Nystrom

Robert Henry Muyskens

Byron Vencent Bell

Kelly Ann Killeen

Curtis Ray Droege

Donald Norman Spitz

Brian Christopher Hart

Jiandong Fang

Scott Richard Castle

James Paul Drummond

Ganesh Vinayak Phatak

John Dennis Zbrozek

Samuel Leo Rhodus

John William Krawczyk

Colin G Maher

Paul W Graf

Kin Ming Kwan

Melissa Marie Waldeck

Gregory Alan Long

Richard Earl Corley

Eric Spencer Hall

Michael Raulinaitis

Paul Albert Cook

Kris Ann Reeves

Ronald Monroe Nowell, Jr

Herbert Gordon Toews, Iii

Robert Allen Samples

Shauna Marie Leis

Rick L Hubert

Qing-Ming Wang

Qing Ming Wang

William Corbett

Andrew N Mcnees

James Michael Mrvos

A physical unclonable function ('PUF') object can be used to encode the geography or region in which device to which the PUF is attached may operate. Disclosed are two potential ways to regionalize a device using a PUF disk: placing the magnetic sensor at a different radius depending on the region or geography intended for sale; and altering the magnetic structure of the disk to magnetically encode the region into the sensor data.

Physical unclonable function (PUF) alters disk structure to encode region

In the invention described, magnetic field characteristics of randomly placed magnetized particles are exploited by using the magnetic field fluctuations produced by the particles as measured by a sensor. The magnetized particles generate a complex magnetic field near the surface of an integrated circuit chip on a bank card or identification card that can be used as a 'fingerprint.' The positioning and orientation of the magnetized particles is an uncontrolled process, and thus the interaction between the sensor and the particles is complex. The randomness of the magnetic field magnitude and direction near the surface of the material containing the magnetic particles can be used to obtain a unique identifier for an item such as an integrated circuit chip on a bank card or identification card carrying the PUF.

Physical unclonable functions in bank cards or identification cards for security

Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.

Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters

A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die. A wire bond connects to the front of the substrate, but is offset from die.

Heater chips with silicon die bonded on silicon substrate, including offset wire bonding

Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material.

Micro-fluid ejection devices with a polymeric layer having an embedded conductive material

A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged to seamlessly stitch together fluid ejections from adjacent chips. Each chip aligns with other chips at peripheral regions having edge tolerances closer than elsewhere along the periphery. The tolerances result from both etching and dicing during chip singulation. Etching occurs at the areas of alignment. Dicing occurs elsewhere. Etching techniques include deep reactive ion etching or wet etching. It cuts a planar periphery through an entire thickness of the wafer. The etching may also occur simultaneously with etching a fluid via. Dicing techniques include blade, laser or ion beam. It cuts an entire remainder of the periphery connecting the portions already etched to free single chips from the wafer. Edge tolerances, planar shapes, dicing lines, etch patterns, and wafer layout provide still further embodiments.

Singulating ejection chips for micro-fluid applications

A fin-shaped heater stack includes first strata configured to support and form fluid heater elements responsive to repetitive electrical activation and deactivation to produce repetitive cycles of ejection of a fluid, and second strata on the first strata to protect the fluid heater elements from adverse effects of the repetitive cycles of fluid ejection and of contact with the fluid. The first strata include a substrate having a front surface, and heater substrata supported on the front surface. The heater substrata have opposite facing side surfaces which extend approximately perpendicular to the front surface and an end surface interconnecting the side surfaces which extends approximately parallel to the front surface such that the heater substrata is provided in either an upright or inverted fin-shaped configuration on the substrate with the fluid heater elements forming the opposite facing side surfaces of the heat substrata.

Fin-shaped heater stack and method for formation

A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si&#x2014;O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.

Heater chips with silicon die bonded on silicon substrate

A method for forming a floating heater element includes processing a silicon substrate to form a heater stack having the heater element on the substrate with peripheral edge portions, processing the heater stack by depositing and patterning a layer of photoresist or hard mask thereon to substantially mask the heater stack and form a trench through the photoresist or hard mask exposing a surface area of the substrate extending along the peripheral edge portions of the heater element, and processing the masked heater stack and exposed surface area of the substrate by sequentially removing the photoresist and portions of the substrate at the exposed surface area and that underlie the heater element so as to create a well in the substrate undercutting the heater element and open along the peripheral edge portions thereof, the well being capable of filling with a fluid so as to produce the floating heater element.

Heater stack in a micro-fluid ejection device and method for forming floating electrical heater element in the heater stack

Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.

Micro-fluid ejection heads with chips in pockets

A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si&#x2014;O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.

Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips

A silicon chip has a plurality of ink jetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interposed between the power transistor and the heater stack. The planarization layer has a planar base surface on which the heater stack is formed.

Ink ejection device including a silicon chip having a heater stack positioned over a corresponding power transistor

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Stamping Ground, KY, United States of America

Carl Edmond Sullivan