Motorola Corporation

Freescale Semiconductor,inc.

Tagore Technology, Inc.

Carl E Wojewoda

James Frank Caruba

Timothy J Collins

Michael Lee Bushman

David Michael Schlueter

Olivier Tico

Richard Unetich

Laurent Bordes

Richard N Sutliff

David W Millen

An integrated radio frequency (RF) switch and method of outputting one RF signal from a plurality of RF signals is provided. The integrated RF switch comprises an input decoder, a plurality of level shifter/drivers, a negative voltage generator and a dynamic bias circuit. The input decoder determines which one of the plurality of RF signals to output. Each one of the plurality of level shifter/drivers controls output of one of the plurality of RF signals. The negative voltage generator creates a negative voltage to drive the plurality of level shifter/drivers. The dynamic bias circuit generates a bias current for the plurality of level shifter/drivers, detects a change of state from the input decoder, generates a pulse in response to detecting the change of state, and increases the bias current for the plurality of level shifter/drivers for a duration of the pulse to decrease a switching time between two RF signals.

Fast Wi-Fi switch with dynamic bias circuit

A controller system controls a plurality of lighting element arrays. The controller system comprises array selection module for selecting a lighting element array, voltage control module arranged to apply a voltage to at least the selected lighting element array, a common current source arranged to provide a current from the common current source to the selected lighting element array, and duty cycle control module arranged to control a ratio of the current to the selected lighting element array over a time sharing cycle. The duty cycle control module is arranged to cause the array selection module to sequentially select the lighting element arrays in accordance with a time-sharing cycle, to cause the current from the common current source to be provided to the selected lighting element array in accordance with a respective duty cycle setting, and to cause the current provided to the selected lighting element array to be compensated for a rise time of the voltage applied thereto in order to be accurate with respect to the programmed settings.

Controller system, integrated circuit and method therefor

A power regulator circuit automatically disables an internal pass transistor when a detection circuit detects the presence of an external pass device. The internal pass transistor is made in an integrated circuit along with a detection circuit and a switch for disabling the internal pass transistor. The detection circuit detects a presence of an external pass device external to the integrated circuit. The switch automatically disables the internal pass transistor when the detection circuit detects the presence of the external pass device. The detection circuit has a comparator for comparing a signal on an outside connection of the integrated circuit and a latch to operate the switch. The comparator compares a voltage on an outside connection of the integrated circuit against a reference after power up of the regulator and can delay operation of the comparison until a predetermined time after power up. An integrated circuit can contain the power regulator circuit and the internal pass transistor. The power regulator circuit can be used on a power supply with a DC power source.

Linear regulator with automatic external pass device detection

A temperature compensation circuit (10) for a crystal oscillator module (12) used in a communication device (200). An existing microcontroller (210) of the communication device (200) is used to provide temperature compensating digital data (30) for a crystal oscillator (18). The temperature compensating digital data (30) is converted to a temperature compensation signal (22) in a digital-to-analog converter (32) which controls the crystal oscillator frequency. The crystal oscillator module (12) includes an onboard voltage regulator (34) which supplies a characterized regulated voltage (36) to the digital-to-analog converter (32) such that the temperature compensation signal (22) from the digital-to-analog converter (32) is inherently corrected for voltage variations in the voltage regulator (34). Changes in the temperature compensation of the crystal oscillator (18) are allowed only when the communication device (200) is not transmitting or receiving.

Temperature compensation circuit for a crystal oscillator and associated

A temperature compensation circuit (10) for a crystal oscillator programmed by a single component (12), such as a resistor. The component (12) provides a voltage to an A/D converter (26). The digital signals (28) from the A/D converter (26) are divided and directed to separate signal generators (44,46,48,50,56) which control different aspects of the temperature compensation circuit (10). These aspects include a hot, cold, linear, balance and warp adjustment. The temperature compensation circuit (10) drives a varactor (18) which reactively loads a crystal oscillator (14) to compensate frequency over temperature. By using a single component (12) to program the circuit (10), an EEPROM is no longer needed which saves IC space and reduces IC processing steps, and the use of multiple external components to perform a compensation is avoided which further saves physical space.

External component programming for crystal oscillator temperature

A substantially sealed frequency source (10) including a crystal oscillator (14) and a programmable IC (22) thermally and electrically coupled on a substrate (12). The IC (22) is accessed through an interface (26) with programming signals (42) so as to provide an analog temperature control signal (34) and a crystal oscillator frequency adjustment signal (36). The substrate (12) maintains a substantially constant temperature at a turning point (82) on a frequency-temperature response curve (80) of the crystal (64). The IC (22) allows programming of the source (10) after sealing to compensate for shifts in the crystal frequency-temperature response (80) due to sealing. The IC (22) provides electrical correction of the substrate temperature setpoint and the crystal oscillator frequency without mechanically or thermally disturbing the internal components of the source (10).

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Lake Zurich, IL, United States of America

Carl E Wojewoda