Incep Technologies, Inc.

Other

Molex Corporation

Carl E Hoge

David H Hartke

Joseph Ted Dibene, Ii

Edward J Derian

Joseph T DiBene

James M Broder

James J Hjerpe Kaskade

James Hjerpe Kaskade

Joseph S Riel

Jose B San Andres

A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

System and method for processor power delivery and thermal management

A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management

Ultra-low impedance power interconnection system for electronic packages

A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface. The apparatus also comprises a second conductive member, having a second conductive member first surface electrically coupleable to the first circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleable to the second circuit board second conductive surface.

Apparatus for delivering power to high performance electronic assemblies

Apparatus for providing power to a microprocessor with integrated thermal and EMI management

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San Diego, CA, United States of America

Carl E Hoge