Applied Materials, Inc.

General Electric Company

Cariappa Achappa Baduvamanda

Gangadhar Sheelavant

Govinda Raj

Ashish Bhatnagar

Bopanna Ichettira Vasantha

Senthil Kumar Sundaram

Kaushik Vaidya

Lit Ping Lam

Rohini Krishnamoorthy

Bopanna Ichettria

Bopanna Ichettria Vasantha

Bhaskar Raj

Ong Pang Yen

Processing chamber components and methods of manufacture of same are provided herein. In some embodiments, a component part body includes a component part body having a base plane and at least one textured surface region, wherein the at least one textured surface region comprises a plurality of independent surface features having a first side having at least a 45 degree angle with respect to the base plane. In at least some embodiments, the textured surface includes a plurality of independent surface features which are pore free.

Textured processing chamber components and methods of manufacturing same

A chamber component for a processing chamber is disclosed herein. In one embodiment, a chamber component for a processing chamber has a base component body. The base component body has an exterior surface configured to face a processing environment of the processing chamber. A textured skin is conformable to the exterior surface. The textured skin has a first side configured to be disposed against the exterior surface and a second side facing away from the first side. The second side has a plurality of engineered features configured to enhance adhesion of material deposited on the textured skin during use of the processing chamber.

Textured skin for chamber components

A process kit ring for use in a plasma processing system is disclosed herein. The process kit ring includes an annular body and one or more hollow inner cavities. The annular body is formed from a plasma resistant material. The annular body has an outer diameter greater than 200 mm. The annular body includes a top surface and a bottom surface. The top surface is configured to face a plasma processing region of a process chamber. The bottom surface is opposite the top surface. The bottom surface is substantially perpendicular to a centerline of the body. The bottom surface is supported at least partially by a pedestal assembly. The one or more hollow inner cavities are formed in the annular body about the centerline. The one or more hollow inner cavities are arranged in a circle within the annular body.

Thermally optimized rings

A substrate heater for a substrate processing chamber which includes a substrate support for a substrate processing chamber which includes a body having a top plate with a substrate receiving surface, and a movable heater disposed in the body, the heater being movable relative to the top plate.

Modular substrate heater for efficient thermal cycling

Embodiments disclosed herein generally relate to a temperature sensor disposed in an apparatus. In many semiconductor, liquid crystal display, solar panel or organic light emitting display fabrication processes, RF power is utilized to either ignite a plasma within the processing chamber or to provide supplemental energy to the process. Temperature control during many processes may be beneficial in order to produce a consistent product. Temperature sensors or thermocouples are sometimes utilized to measure the temperature of a substrate within a processing chamber. The RF power may have a negative impact on the temperature sensor. By coating the temperature sensor with a nanoparticle based metal coating, such as a silver coating, the negative impacts of the RF power on the temperature sensor may be reduced without contaminating the process, and an accurate temperature measurement may be obtained.

EMI/RF shielding of thermocouples

In one embodiment, a radiation shielding composition comprises lead oxide or lead composite material of predetermined particle size, and an adhesive, wherein the composition comprises free flow property.

Radiation shielding composition and a preparation method thereof

Methods and arrangements for reducing partial discharges on a printed circuit board are provided. A method of reducing partial discharge in a printed circuit board includes providing a conducting surface coupled to a component under at least one of electrical and thermal stress, wherein the conducting surface is a metallic plate.

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Bengaluru, India

Cariappa Achappa Baduvamanda