Kabushiki Kaisha Toshiba

Cao Minh Thai

Shinetsu Fujieda

Tetsuji Hori

Tsuguo Kato

Kazuhiko Kurematsu

Shioko Saya

Takeshi Gotanda

Taro Fukaya

Shuichi Suzuki

Izuru Komatsu

Yukihiro Mikogami

Masahiro Tadauchi

Takayuki Oguni

Michiya Higashi

Tomiaki Furuya

Hiroshi Tateishi

Koichi Teshima

Yumiko Oyasato

Tsuguo Sakamoto

A method of treating waste product containing flexible polyurethane resin includes adding a decomposing agent to the waste product to start a decomposition reaction; and terminating the decomposition reaction at a stage in which a diamine concentration derived from an isocyanate raw material of the flexible polyurethane resin is 2 wt % or lower to obtain a pasty intermediate product.

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A method of decomposing a thermosetting resin by a decomposer comprising the steps of: pre-heating the thermosetting resin up to a pre-heating temperature T; kneading the pre-heated thermosetting resin together with a decomposer, and concurrently heating a mixture comprising the thermosetting resin and the decomposer up to a kneading temperature T, thereby allowing a reaction to take place between the decomposer and the thermosetting resin to obtain a kneaded matter wherein the decomposer becomes consumed; and heating the kneaded matter to a maximum temperature Tto thereby decompose the thermosetting resin; wherein the preheating temperature Tis not higher than the boiling temperature of the decomposer; the kneading temperature Tis not lower than the pre-heating temperature Tbut is lower than the thermal decomposition temperature of the thermosetting resin; the maximum temperature Tis lower than the decomposition temperature of the thermosetting resin; and the pre-heating of the thermosetting resin is performed under the following conditions of temperature Tand time t:100&#xb0; C.&#x2266;T0&#x3c;260&#xb0; C.0.5 min&#x2266;t&#x2266;7 min.

Method of decomposing thermosetting resin, apparatus and heat control program

A semiconductor device, comprising a frame including a die pad and a lead portion; a semiconductor element; a wire including one end connected to the semiconductor element and another end connected to the lead portion; at least one first bonding portion formed of a solder material and bonding a part of an upper surface of the die pad to a part which is on a lower surface of the semiconductor element and which is opposed to the part of the upper surface of the die pad; and at least one second bonding portion formed of a thermosetting resin and bonding another part of the upper surface of the die pad to another part which is on the lower surface of the semiconductor element and which is opposed to said another part of the upper surface of the die pad.

Mounting material, semiconductor device and method of manufacturing semiconductor device

Method for recycling thermoset resin materials

Disclosed is a semiconductor device provided with a heat-sink. The semiconductor device comprises a laminated insulating film formed on the heat-sink, a lead-frame mounted on the laminated insulating film, a semiconductor chip mounted to the lead-frame, and a molding resin for molding the semiconductor chip. The laminated insulating film comprises a first insulating resin layer formed on the side of the heat-sink and a second insulating resin layer formed on the side of the lead-frame. The first insulating resin layer is made of an epoxy resin containing 80 wt % of a heat dissipating filler. Also, the second insulating resin layer is made of an epoxy resin containing 70 wt % of a heat dissipating filler.

Semiconductor device provided with heat-sink and method of manufacturing the same

A liquid resin composition prepared by mixing an ionic material and/or a chargeable material into a thermosetting or thermoplastic resin is injected into a mold having a predetermined inner shape, and a DC voltage is applied to the liquid resin composition to concentrate the ionic material and/or chargeable material on a desired portion or to distribute the ionic material and/or chargeable material continuously. Thereafter, the resin composition is thermally cured when the resin composition contains the thermosetting resin, or the resin composition is hardened by cooling when the resin composition contains the thermoplastic resin, thereby obtaining a molding having a predetermined shape.

Method of manufacturing a molding using a filler or an additive

A resin-encapsulated semiconductor device having a semiconductor chip mounted on a die pad with a die bonding portion interposed, a lead arranged in a periphery of the die pad and electrically connected with a bonding pad portion of the semiconductor chip, and an encapsulating resin layer which encapsulates the semiconductor chip so that a part of the lead is guided to the outside, wherein an adhesive resin layer is interposed at least either between the die pad and the die bonding portion is described, or between the semiconductor chip and the die bonding portion.

Growing community of inventors

Yokohama, Japan

Cao Minh Thai