Semiconductor Components Industries, LLC

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Harold Anderson

Francis J Carney

James H Knapp

Yenting Wen

Yong Li Xu

James Mohr

A process of forming an electronic device includes providing a wire comprising a first ball at an end thereof, operating on the first ball to modify a surface of the first ball to form a modified surface, moving the first ball to a first location on a die, and bonding the first ball along the modified surface to the first location of the die. In an embodiment, the process further includes moving a bonding tool including the wire away from the die while the wire remains bonded to the die.

Process of forming an electronic device including a ball bond

In one embodiment, a semiconductor package is formed by adding a layer of particles to desired portions of a packing substrate. The layer of particles forms a matrix of crevices that provides a micro-lock feature for mechanically locking or engaging encapsulating materials.

Semiconductor package structure and method of manufacture

A semiconductor device () includes a semiconductor die () and an inductor () formed with a bonding wire () attached to a top surface () of the semiconductor die. The bonding wire is extended laterally a distance (L, L) greater than its height (H, H) to define an insulating core (). In one embodiment, the inductor is extended beyond an edge () of the semiconductor die to reduce loading.

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Mesa, AZ, United States of America

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