Ams Sensors Singapore Pte. Ltd.

Heptagon Micro Optics Pte. Ltd.

Ams Sensors Asia Pte. Ltd.

Camilla Camarri

Hartmut Rudmann

Mario Cesana

Bassam Hallal

Markus Rossi

Peter Roentgen

Bojan Tesanovic

Kotaro Ishizaki

Jonathan Hobbis

Lukas Steinmann

Elisa Parola

An optical module () comprises an emitter () configured to emit electromagnetic radiation and a first substrate () configured to support the emitter (). The optical module () further comprises a driver () configured to control the emitter () and a second substrate () configured to support the driver (). The first substrate () has a greater thermal conductivity than the second substrate ().

Light emitting module combining enhanced safety features and thermal management

This disclosure describes optoelectronic modules with locking assemblies and methods for manufacturing the same. The locking assemblies, in some instances, can improve mounting steps during manufacturing and can increase the useful lifetime of the optoelectronic modules into which they are incorporated. The locking assemblies can include overmold protrusions, and optical element housing protrusions, as well as locking edges incorporated into overmold housing components.

Optoelectronic modules having locking assemblies and methods for manufacturing the same

Compact spectrometer modules include an illumination channel and a detection channel. The illumination channel includes an illumination source operable to generate a broad spectrum of electromagnetic radiation. The detection channel includes an illumination detector and a Fabry-Perot component. The Fabry-Perot component is operable to pass a narrow spectrum of wavelengths to the illumination detector. Further, the Fabry-Perot component can be actuatable such that the Fabry-Perot component is operable to pass a plurality of narrow spectrums of wavelengths to the illumination detector.

Compact spectrometer modules

An optoelectronic module includes first and second optical channels having respective active optoelectronic components. A transparent encapsulation is over the active optoelectronic components, and opaque encapsulation is on the transparent encapsulation. The opaque encapsulation has a first opening over a first active optoelectronic component and a second opening over a second optoelectronic component. The opaque encapsulation forms a ledge in an area of the second opening, and an optical assembly is disposed on the ledge within the second opening over the second optoelectronic component.

Optoelectronic module having dual encapsulation with opening for receiving an optical assembly

The present disclosure describes proximity sensor modules that include a time-of-flight (TOF) sensor. The module can include a plurality of chambers corresponding, respectively, to a light emission channel and a light detection channel. The channels can be optically separated from one another such that light from a light emitter element in the light emission chamber does not impinge directly on light sensitive elements of the TOF sensor in the light detection chamber. To achieve a module with a relatively small footprint, some parts of the TOF sensor can be located within the light emission chamber.

Proximity sensor module including time-of-flight sensor wherein a second group of light sensitive elements is in a second one of the chambers of the module

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Au, Switzerland

Camilla Camarri