United Technologies Corporation

Rosemount Aerospace Limited

Callum Bailey

Sameh Dardona

Dustin D Caldwell

Wayde R Schmidt

An embodiment of a method for operating a direct write device includes operating a first pump to deliver a first fluid feedstock to a first inlet of a multiaxial needle and operating a second pump to deliver a second feedstock to a second inlet of the multiaxial needle. At least the first and second feedstocks are simultaneously drawn or injected through respective first and second axial passages in the multiaxial needle. At least the first and second feedstocks are combining to a common outlet of the multiaxial needle, forming a single multicomponent deposition material having multiple discrete phases without applying external heat to the first or second feedstocks within the needle. The multicomponent deposition material is deposited from the common outlet onto a substrate.

Multi-material fabrication with direct-write additive manufacturing

A sensor array having a lattice topology includes interconnects having an electrically-conductive layer sandwiched between two dielectric layers, the interconnects defining first-axis interconnects, second-axis interconnects, and interconnect junctions, sensor nodes located on associated interconnect junctions thereby defining an associated first-axis line and second-axis line, a sensor on an associated sensor node, a primary first-axis interconnect interface that is electrically connected to the first-axis interconnects, and a primary second-axis interconnect interface that is electrically connected to the second-axis interconnects. Each sensor node includes a first electrode that is electrically connected to an associated first-axis line, a second electrode that is electrically connected to an associated second-axis line, and a bypass bridge that electrically isolates the associated second-axis line from the associated first-axis line.

Fabrication of high density sensor array

A method of additively-manufacturing a flexible sensor system having a lattice topology includes a number of electrical interconnects, each having one or more electrically-conductive layers alternately sandwiched between two or more dielectric layers, and two or more sensors defining a sensor array, each sensor located at an intersection of and electrically connected to the interconnects on the lattice topology and electrically-connected to the interconnects. Each of the electrically-conductive layers includes a cured material base and silver, copper, aluminum, gold, platinum, ruthenium, carbon, and/or alloys thereof, and each of the dielectric layers includes a cured material base. The additively-manufactured flexible sensor system is configured to be installed on the surface of an asset for the monitoring of that asset.

Large structure monitoring with a substrate-free flexible sensor system

An extendable sensor system having a lattice topology includes a number of extendable interconnects having one or more electrically-conductive layers alternately sandwiched between two or more dielectric layers, two or more interconnect nodes, each located on the lattice topology and electrically-connected to the extendable interconnects to define a sensor array topology, and one or more sensors. The extendable interconnects are arranged in a serpentine pattern that is configured to be expanded, thereby extending the extendable sensor system. The expanded interconnects define an extended sensor system topology, and is configured to be installed on the surface of an asset. Methods of manufacturing an extendable sensor system are also disclosed.

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West Hartford, CT, United States of America

Callum Bailey