Kavlico Corporation

Calin Miclaus

Gary L Casey

Horst Obermeier

Robert D Hunter

Peter H Seesink

Omar Abed

Dan Rodriguez

Described herein is a method for integrating MEMS with submicron semiconductor electrical circuits such as CMOS to provide more complex signal processing, on-chip calibration and integration with RF technologies. A MEMS sensor is provided having an upper layer, an insulating layer into which a cavity has been formed and a handle layer. The upper layer acts as both the substrate of the semiconductor electrical circuit and as the active MEMS element. The remainder of the circuitry is fabricated either in or on the upper layer. In a preferred method of the present invention a first wafer assembly and a second wafer assembly are fabricated such that a MEMS sensor and the substrate of at least one semiconductive electrical circuit is formed.

Cointegrated MEMS sensor and method

A method for monitoring pressure is described herein. The method includes the steps of performing an accurate measurement of pressure and performing an approximate measurement of pressure. Then, providing a notification signal if a difference between the approximate measurement and the accurate measurement is greater than a predetermined value. An apparatus for performing the method is also disclosed.

Method and apparatus for tire pressure monitoring

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Camarillo, CA, United States of America

Calin Miclaus