Growing community of inventors

Sunnyvale, CA, United States of America

Caleb C Han

Average Co-Inventor Count = 4.02

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 40

Caleb C HanTongbi T Jiang (6 patents)Caleb C HanJun Zhai (4 patents)Caleb C HanBrad G Boozer (2 patents)Caleb C HanJames G Horiuchi (2 patents)Caleb C HanPatrick E O'Brien (2 patents)Caleb C HanDavid MacNeil (2 patents)Caleb C HanWilliam Scott Lee (2 patents)Caleb C HanAshwin Balasubramanian (2 patents)Caleb C HanWei Chen (1 patent)Caleb C HanManoj K Bhattacharyya (1 patent)Caleb C HanSavas Gider (1 patent)Caleb C HanJiahui Liang (1 patent)Caleb C HanJie-Hua Zhao (1 patent)Caleb C HanGregory B Arndt (1 patent)Caleb C HanYun X Ma (1 patent)Caleb C HanRoham Solasi (1 patent)Caleb C HanMark G Walsh (1 patent)Caleb C HanCaleb C Han (6 patents)Tongbi T JiangTongbi T Jiang (313 patents)Jun ZhaiJun Zhai (97 patents)Brad G BoozerBrad G Boozer (53 patents)James G HoriuchiJames G Horiuchi (20 patents)Patrick E O'BrienPatrick E O'Brien (15 patents)David MacNeilDavid MacNeil (11 patents)William Scott LeeWilliam Scott Lee (10 patents)Ashwin BalasubramanianAshwin Balasubramanian (8 patents)Wei ChenWei Chen (157 patents)Manoj K BhattacharyyaManoj K Bhattacharyya (80 patents)Savas GiderSavas Gider (28 patents)Jiahui LiangJiahui Liang (18 patents)Jie-Hua ZhaoJie-Hua Zhao (13 patents)Gregory B ArndtGregory B Arndt (11 patents)Yun X MaYun X Ma (3 patents)Roham SolasiRoham Solasi (1 patent)Mark G WalshMark G Walsh (1 patent)
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Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Apple Inc. (6 from 40,816 patents)


6 patents:

1. 12251204 - Blood pressure monitoring system including a liquid filled sensor

2. 11561144 - Wearable electronic device with fluid-based pressure sensing

3. 11422104 - Exposed wire-bonding for sensing liquid and water in electronic devices

4. 10041847 - Various stress free sensor packages using wafer level supporting die and air gap technique

5. 9661411 - Integrated MEMS microphone and vibration sensor

6. 9574959 - Various stress free sensor packages using wafer level supporting die and air gap technique

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as of
12/3/2025
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